Supreme 121AOMed Product Information

Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity

Supreme 11AOHTMed Product Information

Master Bond Supreme 11AOHTMed Epoxy System

Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.

EP4G-80 Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

Supreme 11ANHT-2 Product Information

Supreme 11ANHT-2 Two Part Epoxy

Two component, thermally conductive, electrically insulating epoxy for bonding, coating and sealing featuring small particle size filler

EP21AOLV Product Information

EP21AOLV Two Component Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

Supreme 121AOND Product Information

Supreme 121AOND Two Part Epoxy

Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity

EP30LTE-LO Black Product Information

EP30LTE-LO Two Component Epoxy

Two Component, Black Colored, Low Viscosity, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Encapsulating Featuring Low Coefficient of Expansion and Passes NASA Outgassing Tests with Low Shrinkage Upon Cure.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

EP21QF Product Description

EP21QF Two Component Epoxy

Two component epoxy adhesive, sealant, coating, and encapsulating system. Robust physical strength profile, good flow properties.

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

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