EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

Clone of EP4UF-80 Product Description

EP4UF-80 One Component Epoxy

One component epoxy for bonding and underfill applications, minimum curing temperature 80°C

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

EP17HTDA-2 Product Information

One Part Die Attach Epoxy EP17HTDA-2

One component die attach epoxy system with exceptionally high glass transition temperature. Resists temperatures up to +600°F. Thermally conductive, electrically insulating, Paste consistency.

EP5G-80 Product Description

EP5G-80 One Component Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.

EP4TC-80 Product Description

EP4TC-80 One Part Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

Supreme 3DM-85 Product Information

Supreme 3DM-85 One Component Epoxy

One Component, Toughened Epoxy System Cures at 185°F.

EP42HT-2ANLV Product Information

EP42HT-2ANLV Two Component Epoxy

Two Component, Thermally Conductive, Room Temperature Curable, Heat Resistant Epoxy Adhesive, Sealant, Coating & Casting System. Ideal for Potting and Encapsulation.

Pages