Master Bond Polymer System EP79 is a novel, cost effective, silver-coated-nickel filled epoxy featuring exceptionally low electrical resistance. Volume resistivity is less than 0.04 ohm-cm at room temperature. EP79 has a convenient 1:1 mix ratio and cures readily at room temperature or more rapidly at elevated temperatures.

Master Bond Inc, Hackensack N.J., has introduced a new high performance, low viscosity epoxy adhesive called EP41SMED for fast, room temperature curing, bonding applications. This compound has a 5 to 1 mix ratio by weight and has a “handling” time of as little as 10-15 minutes at ambient temperatures.

Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties. Supreme 11AOHT is a paste that can be applied without sagging or dripping even on vertical surfaces. It has a convenient mixing ratio of 1 to 1 by weight or volume.

A new one component, low viscosity, optically clear, UV curable adhesive called UV10MED has been developed by Master Bond Inc., Hackensack, N.J. This compound is USP Class VI approved and is recommended for use in medical device manufacturing. It offers superior adhesion to metals, glass, ceramics and most plastics.

Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles.