Master Bond Inc. of Hackensack, NJ is proud to announce an incredible breakthrough in polymer technology. Master Bond UV22 is a nanosilica reinforced, UV curable epoxy system that offers a combination of properties not available in conventional epoxy systems.

In many challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond has made available new EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F.

Enhancing productivity and simplifying processing are primary concerns of industrial manufacturing companies in our extremely competitive business climate. In order to facilitate the achievements of these crucial goals Master Bond has extended much effort in research and development, and we are proud to announce the formulation of a new adhesive/sealant, impregnant and liner called EP19HT.

Master Bond Inc., Hackensack, N.J. has developed
a new two part adhesive system called EP21AN with a thermal conductivity in
excess of 22 (BTU•in/ft²•hr•°F). It is an outstanding electrical insulator
with a dielectric strength o >400 volts/mil and a volume resistivity greater
than 1013 ohm-cm. This easy to use adhesive has been formulated

Master Bond Inc., Hackensack, N.J. has introduced a new single component, high performance epoxy adhesive called EP13. This compound requires no mixing and has an unlimited working life at room temperature. EP13 has excellent bond strength to similar and dissimilar substrates and superior dimensional stability. It has a service operating temperature range of -60°F to 450°F.

Master Bond Polymer System EP79 is a novel, cost effective, silver-coated-nickel filled epoxy featuring exceptionally low electrical resistance. Volume resistivity is less than 0.04 ohm-cm at room temperature. EP79 has a convenient 1:1 mix ratio and cures readily at room temperature or more rapidly at elevated temperatures.