Expanded Product List
Master Bond Product Search
178 products match
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Supreme 34AO Room temperature curing epoxy with high thermal stability. Serviceable from -60°F to +450°F. Thermal conductive/electrically insulative. Paste viscosity. Gap filling. Superior durability. Low CTE. High bond strength. Resists repeated thermal cycling. |
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Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
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Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |
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Supreme 3ANLV-1 Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Flowable viscosity. Shore D hardness 80-90. Serviceable from -100°F to +300°F. |
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Supreme 3AO Low temperature curing thermal conductive epoxy adhesive. Outstanding toughness and durability. Dimensional stability. Easy application. Gray color. Serviceable from -100°F to +300°F. |
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Supreme 3AOHT One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Paste viscosity. Serviceable up to 350°F. |
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Supreme 3CCM-85 One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F. |
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Supreme 3DM-85 One part epoxy for bonding, sealing, and dam-and-fill applications, and chip on board encapsulations. Cures at 185°F. Reliable electrical insulator, Used as a barrier to block flow. Thermally conductive, electrically isolating, paste consistency. |
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Supreme 3HTND-1SM One part, oven curing system (cures at 125-150°C) with rapid curing. Good physical properties. Paste consistency. Recommended for surface mounting. Void filling. Low ioinic impurities. Superior "green" strength. No stringing. Withstands thermal stress. Consistent dot profile. Can be automatically dispensed for high volume applications. Serviceable from -100°F to +350°F. |
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Supreme 3HTND-2CCM Toughened epoxy system for bonding, sealing, coating, encapsulation, glob topping. Requires no mixing. Rapid heat curing Passes NASA low outgassing testing. Transfers heat efficiently. Ideal rheology and flow for multiple applications. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |