Expanded Product List
Master Bond Product Search
431 products match
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EP21LV-LO NASA low outgassing approved. High physical strength properties. Easy to mix and apply. Excellent chemical resistance. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. Ideal for potting and encapsulation. Vacuum compatible. |
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EP21LV3/5Med Low viscosity epoxy adhesive, sealant, coating and casting compound. USP Class VI approved. Resists vibration, impact, shock., thermal cycling. Ideally suited to bond dissimilar substrates. Serviceable from -80°F to +250°F. Withstand exposure to EtO, radiation and chemical sterilants. Excellent toughness. |
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EP21LVFL Epoxy adhesive, sealant, coating with excellent flexibility, low modulus, flows easily and readily. Resists thermal cycling, shock, vibration and other types of stresses. Bonds well to a wide range of substrates including metals, glass, ceramics, composites, as well as many types of rubbers and plastics |
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EP21LVMed Biocompatible two component epoxy adhesive, sealant, coating, encapsulant. Passes USP Class VI testing. Thermal cycling resistant. Can withstand exposure to EtO, radiation, chemical sterilants. Low viscosity. Easy to apply. Serviceable from -65°F to +250°F. |
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EP21LVSP6 Two component epoxy has very low exotherm, Suitable for large casting applications. Low viscosity formulation cures at room temperature. Extended working life. Serviceable from -60°F to +250°F. Magnificent electrical insulation properties. Excellent physical strength. |
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EP21LVTK-2 Moderate viscosity with good flow. Room temperature curing epoxy adhesive, sealant, casting. Convenient one to one mix ratio, weight or volume. High strength system. Withstands exposure to many chemicals. Reliable electrical insulator. Serviceable from -60°F to +250°F. |
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EP21ND Two part, room temperature curing epoxy with easy handling and very good physical strength properties. Non-drip paste. For bonding, sealing, coating. One to one mix ratio. Chemically resistant. Gap filling. Variable mix ratio allows adjusting hardness of cure. Low shrinkage. Service temperature range from -60°F to 250°F. |
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EP21ND-2 Two component non-drip epoxy paste. Outstanding physical strength properties. Non-critical one to one mix ratio. Easy to apply. Variable mix ratio to adjust fardness of cure. Excellent dimensional stability. Serviceable from -60°F to 250°F. |
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EP21ND-LO Non-drip epoxy paste passes NASA low outgassing requirements. Can be applied without sagginf on vertical surfaces. Gap filling. Dimensionally stable. Cures at ambient temperatures. Long term durability. Serviceable from -60°F to 250°F. |
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EP21ND-LP Two part, room temperature curing epoxy with easy handling and very good physical strength properties. Smooth paste. For bonding, sealing, coating. One to one mix ratio. Chemically resistant. Gap filling. Variable mix ratio allows adjusting hardness of cure. Low shrinkage. Service temperature range from -60°F to 250°F. |