One Component Epoxy

Epoxy Impregnant Seals Metals & Nonmetals

Enhancing productivity and simplifying processing are primary concerns of industrial manufacturing companies in our extremely competitive business climate. In order to facilitate the achievements of these crucial goals Master Bond has extended much effort in research and development, and we are proud to announce the formulation of a new adhesive/sealant, impregnant and liner called EP19HT. We feel that this compound’s outstanding performance profile and easy handling represents significant improvements over conventional systems presently in use.

Master Bond EP19HT is a storage-stable, one component, low viscosity system that cures readily at elevated temperatures to a tough, strong and chemically resistant thermoset plastic. Its viscosity is 500-600 cps at 75°F. Recommended cure is 1 hour at 250°F. Shorter cures can be achieved at temperatures between 325-350°F. EP19HT is a 100% reactive system, containing no solvents or diluents. It has a service operating temperature range of -60°F to +400°F. Shrinkage upon cure is minimal.

Master Bond EP19HT has excellent electrical insulation properties. It has a volume resistivity of greater than 1015 ohm·cm. It has a tensile strength greater than 10,000 psi and a heat deflection temperature of more than 280°F. It has a clear amber color. Resistance to water, inorganic acids, bases, salts and many organic solvents is outstanding. Particularly noteworthy applications include sealing porosity in graphite, use as an adhesive/sealant for electronic/electrical applications, and service as a chemically resistant liner.

Single Component Snap Cure Epoxy Has Outstanding Electrical Properties and Chemical Resistance

Master Bond EP17HT-3 is a one part epoxy that sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250°F-300ºF. As a one part system, no mixing is required and the epoxy can be cured in sections up to 1/4" thick. Moreover, its working life is indefinite as it will not gel until heated above 200ºF.

With a volume resistivity of greater than 1014 ohm-cm, EP17HT-3 has excellent electrical insulation and chemical resistance characteristics. It is resistant to a wide range of chemicals including water, oil and most organic solvents. Other typical features include a Shore D hardness that exceeds 85 and a tensile lap shear of 2100 psi.

Master Bond's EP17HT-3 adhesive has superior temperature resistance with a service operating temperature range of -60ºF to +400ºF. It is 100% reactive and contains no solvents or diluents. It is also available in a paste version called EP17HT-3ND and a slightly toughened variant called Supreme 17HT-3 which is ideal for bonding dissimilar substrates and applications subject to thermal cycling. Each product comes in half pints, pints, quarts, gallons and 5 gallon container sizes.

New One Component Adhesive/Sealant Resists Up To 600°F

Master Bond Inc., Hackensack, N.J. has developed a new toughened one component heat curing epoxy adhesive/sealant, called EP17. This compound has a service operating range of from -300°F to as high as 600°F. It is formulated to cure at temperatures from 300°F to 350°F for 60-90 minutes. EP17 bonds well to a variety of substrates including metals, glass, ceramics, vulcanized rubbers and many plastics. It has excellent resistance to a wide range of chemicals including fuels, acids, bases, oils and many solvents.

Master Bond EP17 possesses high physical strength properties and is readily machinable. It has superior dimensional stability and very low shrinkage upon cure. Tensile strength is 8,700 psi and tensile modulus is 387,000 psi. EP17 has a Shore D hardness of >90 and a compressive strength of >13,000 psi.

Master Bond EP17 is easy to use. It does not require any mixing prior to use and has an "unlimited" working life at room temperature. It is 100% reactive and does not contain any solvents or diluents. The standard color is gray. Its electrical insulation properties are superior. EP17 is a flowable paste and can also be formulated for application on vertical surfaces without sagging or dripping (EP17ND).

EP17 is available for use in pint, quart, gallon and 5 gallon containers.

One Part Epoxy Adhesive Resists High Temperatures

Master Bond Inc., Hackensack, N.J. has introduced a new single component, high performance epoxy adhesive called EP13. This compound requires no mixing and has an unlimited working life at room temperature. EP13 has excellent bond strength to similar and dissimilar substrates and superior dimensional stability. It has a service operating temperature range of -60°F to 450°F.

Master Bond EP13 is 100% reactive and does not contain any solvents or diluents. It can be applied to vertical surfaces without sagging or dripping. It cures at temperatures of 300°F to 350°F for 60-90 minutes. The higher the temperature the faster the cure speed.

EP13 possesses high compressive strength and is readily machinable. Upon cure, EP13 readily obtains tensile shear strengths in excess of 3,500 psi. Resistance to a wide range of chemicals including fuels, acids, bases, oils and many solvents is exceptional. EP13 has low shrinkage upon cure and good electrical insulation properties. The standard color is grey.

Master Bond EP13 is available in pint, quart, gallon and 5 gallon containers.

Bonding Substrates with Different Thermal Expansion Coefficients

One of the most difficult of all adhesive applications is the bonding of substrates with different coefficients of thermal expansion (CTE). Common examples include bonding aluminum to glass, glass to plastics, ceramic to plastics and rubbers to metals. Additionally, stresses caused by temperature extremes in service and thermal cycling sometimes make a difficult situation more complicated.

Best Methods of Increasing Cure Speed

One of the most frequently asked questions raised by engineers, technicians and designers of polymer bonded assemblies, sealants and encapsulants is how to increase the curing speed of a specific polymer composition for a particular application.

Bonding Dissimilar Substrates

Bonding Dissimilar Substrates

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One Part Epoxies Simplify Processing

Single component, no mix epoxies are gaining increasing popularity over traditional two component systems. They are commonly employed in bonding, sealing, coating and potting applications. These systems are precatalyzed and require only moderate heat to cure.

Low Temperature Serviceability

Master Bond adhesives are designed for low temperature environments

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Thermal Shock Resistant Adhesives

Thermal Shock Resistant Adhesives

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