One Component Epoxy

Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHP™) using V-PRO® s2 Low Temperature Sterilization System. This study was recently published in a peer-reviewed journal Polymer-Plastics Technology and Materials.

As medical devices have evolved through technological advancements, they have become more complex in both their design and materials of construction. Medical grade biocompatible epoxies are widely used in reusable medical devices. Choosing an epoxy that maintains its performance characteristics when subjected to repeated sterilization throughout the reusable medical device’s lifespan is a known challenge for medical device manufacturers. This study evaluated the material compatibility of seven cured two part and one part epoxies used in medical devices following exposure to 100 cycles in a low temperature vaporized hydrogen peroxide sterilizer.

Six of the seven epoxies tested were found to be compatible with vaporized hydrogen peroxide sterilization based on qualitative, hardness and weight measurements conducted post exposure to 100 VHP cycles. The epoxies deemed to be compatible displayed no visual signs of physical defects, minimal reduction in hardness (≤2%) and total weight gain (≤2.9%). This study highlights the importance of conducting material compatibility studies, and continued collaborations (among medical device manufacturers, sterilizer manufacturers and epoxy manufacturers) during the early stages of medical device development to ensure a successful reusable medical device that will withstand repeated sterilization

Key Findings from the Study about Master Bond Medical Adhesive Systems

The Master Bond EP42HT-2Med, EP42HT-4AOMed Black, EP62-1HTMed, EP41S-5Med, EP4CL-80Med and UV10TKMed epoxies are compatible with low temperature vaporized hydrogen peroxide, as they maintained their surface texture, exhibited less than 2% change in hardness, and displayed less than a 2.5% weight gain post exposure to 100 VHP cycles.

To read the experiment and results in its entirety please go to https://www.tandfonline.com/doi/full/10.1080/25740881.2024.2376209 or contact technical support to discuss your application.

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (T_g) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HTND-2 has reliable electrical insulation properties with a volume resistivity exceeding 10¹⁵ ohm-cm at 75°F. It possesses high bond strength properties with a lap shear strength of 1,900-2,100 psi and a tensile strength of 7,000-8,000 psi. It is designed to withstand thermal cycling and offers a wide service temperature range from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, it has a paste consistency and is completely non-drip, making it ideal for applications where no flow is critical.

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours, followed by a post cure at 350°F for 8-12 hours. It bonds well to a wide variety of substrates including metal, ceramics, composites and several plastics. Black in color, it is available in standard packaging of jars and cans, ranging from ½ pint to gallon containers.

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance.

EP5LTE-100 passes NASA low outgassing specifications. It provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10^-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion. With a T_g between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than 10¹⁴ ohm-cm.

EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. The compound has an unlimited working life at room temperature and requires a heat cure at 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. The epoxy is available in syringes, jars, and cans.