Master Bond is a leading supplier of adhesives, sealants, coatings, potting compounds used in the manufacture, assembly and maintenance of multiple types of computer hardware.
When considering the effectiveness of an epoxy adhesive, it is useful to analyze the general formulation of the compounds that constitute it. Epoxies are created by polymerizing a mixture of two starting compounds, the resin and the hardener. When resin is mixed with a specified catalyst, curing is initiated.
The demand for capacitors that can reliably perform in high temperature applications has sharply increased in the microelectronic industry, particularly for aerospace, defense, transportation and oil, gas and chemical processing applications.
With circuit board real estate at a premium and a constant drive to increase production rates and ensure reliable long-term performance, glob tops are one of the options designers are turning to.
When designing adhesive bonding applications, optimizing joint design is an important consideration. Adhesive joints are not geometrically limited the way their mechanical fastener counterparts are. This leaves designers free to focus on the various mechanical and chemical stresses a specific joint is expected to withstand at its anticipated service temperature range.
Thermal management is of crucial importance to the electronic industry. Smaller, tightly packaged circuits and components create excess heat which ultimately affects the reliability and life of numerous electronic devices. With expectations for further miniaturization, the need for compounds to mitigate these problems is more essential.