One Component Epoxy

Thermal Interface Materials

Industrial Adhesives for Thermal Interface ApplicationsRemoval of excess heat is essential for the long term performance and viability of electronic devices.

Undefined

Epoxy Innovations Drive Adhesive Bonding Growth

Whereas once mechanical fasteners may have been the assembly option of choice, tremendous strides in polymer chemistry over the past few decades have made epoxy resins technically and economically superior. In this white paper, we explore the various performance characteristics of adhesive technologies and their use in modern applications across many industries.

Epoxy Compounds Get Even Tougher

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

High Strength, One Component Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 10HT is a uniquely versatile system that combines high shear and peel strengths with convenient handling. This one part system eliminates mixing and cures in just 60-75 minutes at 250°F. It can withstand severe cryogenic temperatures to extreme heat with a temperature range of 4K to +400°F.

Supreme 10HT offers exceptional physical properties including tensile shear strength in excess of 3,600 psi and T-peel strength up to 30 pli. Its superior flexibility and toughness enable it to resist thermal cycling, mechanical shock, vibration and stress fatigue cracking. Supreme 10HT can also withstand exposure to a wide variety of chemicals, such as water, oils, fuels, solvents, acids and bases. The cured epoxy is a superior electrical insulator.

This durable adhesive has a number of outstanding processing advantages—the viscosity remains constant and will not thicken with time, the working life is unlimited at room temperature and it is room temperature storable. It has excellent adhesion to metals, glass, ceramics and many plastics.

NASA low outgassing approved, Supreme 10HT’s exceptional collection of high performance properties makes it suitable for a wide range of industries, including aerospace, electronic, electrical, computer, metalworking, appliance, automotive and chemical. Supreme 10HT is available in a variety of standard and specialty packaging options including ½ pints, pints, quarts, gallons, 5 gallons, cartridges and syringes.

Flexibilized, Thermally Conductive One Part B-Stage Epoxy Resists High Temperatures

Formulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. This flexible, heat resistant epoxy has superior mechanical properties.

Serviceable over the wide temperature range of -80°F to +500°F, EP36AO provides high performance in harsh conditions. Once cured, it features solid electrical characteristics including a dielectric strength of 400 volts/mil, a volume resistivity of 2-3 x 1012 ohm-cm and thermal conductivity of 9-10 BTU·in/ft2·hr·°F at 25°C. This system has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi. EP36AO is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.

As a one component system, EP36AO doesn't require any mixing and offers the convenience of flexible cure schedules. A typical gel time is 30 minutes at 180°F, with full cures attained in 2-2½ hours at 300°F. This can be shortened further at higher temperatures. EP36AO will retain its liquidity as long as the temperature does not exceeed 180°F. It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container. EP36AO is available in pints, quarts, gallons and five gallon containers. It is now also available in conveniently prepared 30 gram cookies.

Electrically Conductive Adhesives Make Right Connections

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

Understanding Bond Line Thickness

Bond line thickness is one of the important factors to be considered in designing a bond joint. Most commonly used bond line thicknesses in a bond joint range from about 0.001 to 0.007 inches.

One Part Epoxy Offers Exceptionally High Tensile Strength

Primarily used for testing the adhesion or cohesive strength of flame sprayed coatings as per the ASTM C633 specification, Master Bond EP15 produces high strength bonds across a wide variety of applications. This one component epoxy bonds well to many similar and dissimilar substrates. Particularly noteworthy is its adhesion to metals and ceramics.

Featuring a tensile strength exceeding 12,000 psi at room temperature, this 100% reactive system offers superior dimensional stability with minimal shrinkage upon cure. It is serviceable from -60°F to 250°F. EP15 has superior chemical resistance properties and withstands thermal cycling.

As a one part system, EP15 features an unlimited working life and does not require any mixing prior to use. This system offers good flow properties with a viscosity of 40,000-65,000 cps and can be easily applied with a brush, paint roller or spatula. It cures quickly in 60-90 minutes at 300-350°F.

The standard color for this epoxy is tan and it is available in many sizes, including 1/2 pint, pint, quart, gallon and 5 gallon containers. Master Bond EP15 has a minimum shelf life of 3 months when stored in original, unopened containers.

New Electrically Conductive, Silver Filled Adhesive/Sealant is USP Class VI Approved

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMed epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMed is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.

EP3HTSMed is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMed bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.

Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMed has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

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