An adhesive utilized for hermetically sealing batteries must fulfill several criteria, including resistance to chemicals, temperature, pressure, and electricity. It should exhibit minimal outgassing, low moisture permeability, high adhesion to packaging materials, and suitable modulus and thermal expansion properties.
The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands.
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.
Advanced power and high frequency communications electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives.
Die attach adhesives serve a vital role in semi-conductor assembly, manufacturing and throughout the product life cycle. In this white paper, learn how they facilitate assembly and about the application process. Find out why thin bond lines are so important for product life cycle.
