EP4UF-80 Product Description

EP4UF-80 One Component Epoxy

One component epoxy for bonding and underfill applications, minimum curing temperature 80°C

EP4EN-80 Product Description

EP4EN-80 One Component Epoxy

One component epoxy for bonding and small encapsulation applications, minimum curing temperature 80°C. Thermally conductive, electrically insulating.

EP51CC Product Information

EP51CC Two Component Epoxy

Two Component Epoxy Adhesive For Fast Curing, High Performance Bonding and Sealing

EP21ARLV Product Information

EP21ARLV Two Component Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Acids and low viscosity.

EP21NS Product Information

EP21NS Two Component Epoxy

Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Optical Clarity.

EP42-2LV Black Product Information

 EP42-2LV Black Two Component Epoxy

Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical Resistance is NASA low outgassing approved.

EP42HT-4AOMed Black Product Information

EP42HT-4AOMed Black Two Component Epoxy

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System Featuring Outstanding Heat, Chemical and Steam Resistance for Medical Device Manufacturing.

EP30-4Med Product Information

EP30-4Med Two Component Epoxy

Optically Clear, Two Component Epoxy Adhesive for High Performance Bonding, Coating, Sealing and Casting Featuring Superior Non-Yellowing Properties, Low Viscosity and Rapid Curing for Medical Device Assembly.

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