Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing and Encapsulating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.