Two Component, Room Temperature Curing Epoxy Resin for Bonding, Coating, Sealing and Potting Offers Outstanding Non-Yellowing Characteristics; Featuring Low Viscosity and Exceptionally Long Storage Stability; Can Be Utilized in Thicker Encapsulations.
Highly Versatile, Low Viscosity, Two Component Epoxy System for High Performance Bonding, Coating, Sealing and Casting; Featuring Superb Light Transmittance.
Low Viscosity, Two Component Epoxy Compound for High Performance Sealing, Casting, Potting and Bonding Featuring Superior Electrical Insulation Properties and Lower Exotherm; Standard Color is Black.
One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic paste.
One Component, Nanosilica Filled UV Curable Epoxy System that cures in shadowed out areas for Bonding, Sealing, Coating and Encapsulation. Thixotropic, moderate viscositiy.
Specialized, One Component, Heat Curing Epoxy Featuring High Tensile Strength for Testing Adhesion or Cohesive Strength of Flame-Sprayed Coatings as per ASTM Specification C633.
