Flowable, one part epoxy with a low coefficient of thermal expansion. Cures at 100°C. Serviceable from -60°C to +175°C.
Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.
Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..
One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.
One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5
One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.
Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation
Two Component, thermally conductive, electrically insulative epoxy system for medical device applications. ISO 10993-5 certified.
Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity