EP21AOLV Product Information

EP21AOLV Two Component Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

Supreme 11HTND Product Information

Supreme 11HTND Two Component Epoxy System

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength

EP40ND Product Information

EP40ND Two Part Epoxy System

Two component, epoxy compound with a paste consistency, outstanding shear and peel strength for bonding, sealing and coating, featuring excellent adhesion to engineering plastics and metals, especially polycarbonates and acrylics

EP5LTE-100 Product Information

EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion

Flowable, one part epoxy with a low coefficient of thermal expansion. Cures at 100°C. Serviceable from -60°C to +175°C.

EP42HT-2FG Black Product Information

EP42HT-2FG Black Two Part Epoxy

Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

EP4CL-80Med Product Description

One Part Epoxy EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5

EP4CL-80 Product Description

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.

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