Supreme 11ANHT-2 Product Information

Supreme 11ANHT-2 Two Part Epoxy

Two component, thermally conductive, electrically insulating epoxy for bonding, coating and sealing featuring small particle size filler

EP21LVFL Product Information

Two Component, Low Viscosity Epoxy System For Bonding, Sealing, Coating, Encapsulation. High elongation, low modulus.

EP21AOLV Product Information

EP21AOLV Two Component Epoxy

Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.

Supreme 11HTND Product Information

Supreme 11HTND Two Component Epoxy System

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -112°F to +400°F Featuring High Peel and High Shear Strength

EP40ND Product Information

EP40ND Two Part Epoxy System

Two component, epoxy compound with a paste consistency, outstanding shear and peel strength for bonding, sealing and coating, featuring excellent adhesion to engineering plastics and metals, especially polycarbonates and acrylics

EP5LTE-100 Product Information

EP5LTE-100 is a flowable, one part epoxy with a low coefficient of thermal expansion

Flowable, one part epoxy with a low coefficient of thermal expansion. Cures at 100°C. Serviceable from -60°C to +175°C.

EP42HT-2FG Black Product Information

EP42HT-2FG Black Two Part Epoxy

Two Component, Room Temperature Setting, Heat Resistant Epoxy System for Bonding, Sealing, Coating & Casting Specially Formulated for Indirect Food Applications.

EP35AOLV Product Information

Two Component Thermally Conductive Heat Resistant Epoxy Compound for High Performance Structural Bonding, and Casting

EP5TC-80 Product Description

EP5TC-80 One Component Paste Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength..

EP4G-80Med Product Description

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Meets ISO 10993-5 for cytotoxicity. Graphite filled. Thermally conductive, electrically conductive, high compressive strength.

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