EP4CL-80Med Product Description

One Part Epoxy EP4CL-80Med

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. Meets ISO 10993-5

EP4CL-80 Product Description

One component, optically clear epoxy for bonding and sealing that cures at 80°C to 85°C. Ultra low viscosity. May be utilized for impregnation applications and spin coating.

EP62-1LPSPMed White Product Information

Two Part Epoxy EP62-1LPSPMed White

Two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation

EP40TCMed Product Information

Two Component Epoxy EP40TCMed

Two Component, thermally conductive, electrically insulative epoxy system for medical device applications. ISO 10993-5 certified.

EP62-1HTMed Product Information

Two Component Epoxy EP62-1HTMed

Two Component Epoxy System Features a Very Long Pot Life at Ambient Temperatures Combined with Rapid Cures and Sterilization Resistance, Passes 10993-5 for Cytotoxicity

EP4S-80 Product Description

One Part, Silver Filled Epoxy

One component epoxy for bonding, sealing and coating applications, curing temperature 80°C. Electrically conductive, NASA low outgassing.

EP40TC Product Information

Two Part Epoxy EP40TC

Two Component, Flexible, Moderate Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding And Sealing. High strength structural bonding. NASA low outgassing.

EP5G-80 Product Description

EP5G-80 One Component Epoxy

One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally and electrically conductive, high compressive strength. Meets NASA low outgassing specifications. Non-metallic, graphite filler.

Supreme 11HTLV Product Information

Supreme 11HTLV Two Component Epoxy

Two Component, Room Temperature Curing High Temperature Resistant Epoxy Adhesive/Sealant For Service from -100°F to +350°F Featuring High Peel and High Shear Strength

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