One component epoxy for bonding, sealing and small encapsulation applications, curing temperature 80°C. Thermally conductive, electrically insulating, high compressive strength.
Two Component, Low Viscosity Room Temperature Curable, Epoxy Adhesive, Sealant, Coating & Casting System Featuring Both Outstanding Chemical Resistance is NASA low outgassing approved.
Two Component, Flexible, Low Viscosity Epoxy Compound Meets ISO 10993-5 certification. Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Excellent Adhesion To Engineering Plastics And Metals, Polycarbonates And Acrylics
One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
