High Shear Strength

EP17HTND-2 Product Information

EP17HTND-2 One Part, Heat Cure Epoxy

One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F.

EP3HTS-LO Product Information

One Component Epoxy Compound

One Component, Heat Curing, Silver Filled, Electrically Conductive Epoxy Adhesive/Sealant Featuring High Shear Strength and Good Temperature Resistance Along With a Rapid Cure Speed.

X5G Product Information

X5G One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5N Product Information

X-5N One Part Elastomeric Compound

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

X5SC Product Information

X5SC One Part Elastomeric System

Thermally Conductive, Elastomer Based, One-Component Adhesive For High Performance Bonding and Sealing

Supreme 45HTQ-4 Product Information

Supreme 45HTQ Two Component Epoxy

Two component epoxy system for bonding, sealing and casting

Supreme 34CA Product Information

Supreme 34CA Two Component Epoxy

Two Component Epoxy Resin System for High Pertormance Applications

EP30-2LB Product Information

EP30-2LB Two Part Epoxy System

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity. Meets NASA Low Outgassing Specifications.

EP17HT-100 Product Information

EP17HT-100 One Part Epoxy Compound

One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 650°F.

EP21NDCL Product Information

EP21NDCL Two Part Epoxy System

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

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