Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Flexibilized For High Performance Bonding Featuring Exceptionally High Thermal Conductive
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance
Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications
Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing, Coating and Potting Featuring Optical Clarity and High Temperature Resistance. Conforms to FDA Section 175.105 for Indirect Food Applications.
