EP21ND Product Information

EP21ND Two Part Epoxy

Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.

EP21ND-2 Product Information

EP21ND-2 Two Part Epoxy

Two Component Non-Drip Epoxy for High Performance General Purpose Bonding, Sealing, and Coating

EP21TDCANHT Product Information

EP21TDCANHT Two Part Epoxy System

Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive Flexibilized For High Performance Bonding Featuring Exceptionally High Thermal Conductive

EP21TDCAOHT Product Information

EP21TDCAOHT Two Part Epoxy

Two Component Thermally Conductive, Electrically Insulative

EP21TDCHT Product Information

EP21TDCHT Two Part Epoxy

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance.

EP21TDCHT-1 Product Information

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance

EP21TDCHT-LO Product Information

EP21TDCHT-LO Two Component Epoxy Adhesive

Room Temperature Curing, Toughened Two Component Epoxy Adhesive for General Purpose Bonding and Sealing; Features High Peel Strength and Shock Resistance. Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

EP21TDCSMed Product Information

EP21TDCSMed Two Part Medical Grade Epoxy

High Performance, Two Component, Silver Conductive Epoxy Adhesive/Sealant Featuring High Peel Strength, Superior Toughness and Exceptionally Low Volume Resistivity. Meets USP Class VI Specifications for Medical Applications

EP3 Product Description

EP3 One Part Epoxy

One Component Heat Curing Epoxy Adhesive Featuring Both High Shear and High Cure Speed for Optimal Bonding Performance

EP30-2 Product Information

EP30-2 Two Part Epoxy Compound

Versatile Lower Viscosity, Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation; Features Superior Optical Clarity; Cryogenically Serviceable. Meets NASA Low Outgassing Specifications.

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