One Component, Heat Curing Structural Adhesive Featuring High Tensile Shear Strength and High Temperature Resistance for Optimal Bonding Performance Up To 450°F
Specialized, One Component, Heat Curing Epoxy Featuring High Tensile Strength for Testing Adhesion or Cohesive Strength of Flame-Sprayed Coatings as per ASTM Specification C633.
One Component, Epoxy System for Bonding, Sealing, Coating and Casting Heat Featuring Exemplary Temperature and Chemical Resistance. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F.
One Component, Toughened Heat Curing Structural Adhesive/Sealant Featuring Outstanding Strength, Chemical and High Temperature Resistance for Service Up To 550°F
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Part, Room Temperature Curing Epoxy System Offers Thermal Conductivity and Electrical Insulation for Potting & Encapsulation as well as Bonding, Sealing and Coating; Has a Forgiving One to One Mix Ratio.
Two Component, Radiopaque Epoxy System for High Performance Bonding, Sealing, Coating and Encapsulation featuring Outstanding Performance Properties and Easy Handling
Two Component, Room Temperature Curing Epoxy for High Performance Bonding, Sealing and Coating with Outstanding Physical Properties, Easy Handling and Non-Drip Feature. Meets Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 for Food Applications.
