Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
Two Component, Flexible, Low Viscosity Epoxy Compound With Outstanding Shear and Peel Strength For Bonding, Potting, And Sealing. Featuring Excellent Adhesion To Engineering Plastics And Metals, Especially Polycarbonates And Acrylics
Two Component Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating. Including Small Encapsulations, Pottings & Castings Featuring Fast Set-Up and Handling Time Meets USP Class VI and ISO 10993-5 Specifications for Medical Applications.