Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.
One Component, Toughened Epoxy Adhesive/Sealant Featuring Exceptionally High Peel and Shear Strength, Convenient Processing and Serviceability at Cryogenic and High Temperatures. Thoroughly Non-Drip Formulation.
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating, and Heat Resistant Epoxy Compound for High Performance Bonding and Sealing. Serviceable from 4K to 400°F. Meets NASA Low Outgassing.
Two Component Epoxy System with Outstanding Flexibility and Peel Strength for High Performance Bonding, Sealing, Coating and Encapsulation. Serviceable at Cryogenic Temperatures.
Two Component, Flexibilized, Highly Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation.
