One Component, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications. B-Stage Epoxy Is Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Very High Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Encapsulation, Coating and Bonding Applications; Featuring Thermal Conductivity and Electrical Isolation. Available in 30 Gram Cookies.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
Two Component, Low Viscosity, Room Temperature Curing Epoxy Resin System For High Performance Potting, Encapsulation, Sealing and Bonding Featuring Outstanding Resistance to Thermal Shock and Mechanical Vibration, Serviceable up to 450°F
