Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive for Bonding, Sealing, Coating and Encapsulating Featuring a Convenient and Forgiving 1:1 Mix Ratio.
One Part, Lower Viscosity, Thermally Conductive Epoxy System for High Performance Potting, Encapsulation and Underfill Applications Featuring Exceptional Dimensional Stability and Rapid Curing at 230-250°F.
One Component Sodium Silicate, Aqueous Based Silver Conductive Coating System Featuring Awesome Shielding Effectiveness, Temperature Resistance Up To 700°F and Easy Application.
Two Component, Highly Flexiblized, Thermally Conductive, Electrically Insulating Epoxy Resin Compound for High Performance Bonding, Sealing, Coating and Encapsulation. Passes NASA Low Outgassing Test.
