OEM

New Medium Viscosity, Optically Clear Epoxy System Resists Up to 400°F

Master Bond Inc., Hackensack, N.J. has recently developed a new medium viscosity, two component epoxy adhesive/sealant, coating and casting compound called EP30HT. It is formulated to cure at room temperature or more rapidly at elevated temperatures. EP30HT features superior dimensional stability, superb optical clarity and high temperature resistance up to 400°F. It conforms to Title 21, U.S. Code of Federal Regulation, FDA Chapter 1, Section 175.105 and 175.300 for food applications.

Master Bond EP30HT has a 4 to 1 mix ratio by weight. It is 100% reactive and does not contain any solvents or volatiles. Its moderate viscosity and exceptionally low shrinkage - 0.0003 inches/in make it well suited for casting. Adhesion to metals, glass, ceramics, woods, vulcanized rubbers and many plastics is excellent. The hardened compound has superior electrical insulation properties.

EP30HT will resist exposure to water, oil and most organic solvents. It has a refractive index of 1.54 and a spectural transmittance (3100-9000Å) of 97%. Its dielectric strength is 440 volts/mil and its volume resistivity is >1015 ohm cm. Color of Part A is clear and Part B is clear.

EP30HT is available for use in half-pint, pint, quart, gallon and 5 gallon container kits. It is also available in easy to use convenient syringe applicators.

Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability

Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a wide service temperature range of 4K to 250ºF. Its thermal conductivity is 9-10 BTU/in/ft²/hr/ºF. The viscosity of the mixed compound is 5,000 to 6,000 cps at 75ºF. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

New Flexible, Low Viscosity Potting Compound

A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.

Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.

Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.

Room Temperature Curing, Flexibilized Epoxy Combines High Strength and Toughness with Chemical and Abrasion Resistance

Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness. This two component epoxy is ideal for high performance bonding, sealing, coating, and encapsulating applications in the electronic, electrical, computer, metalworking, optical, electro-optical and oil/chemical processing industries. Its lower exotherm also makes it ideal for casting and potting in cross section thicknesses of over one inch.

Serviceable over the wide temperature range of -100ºF to above +250ºF, EP30D-7 is designed to cure at room temperature or more rapidly at elevated temperatures with minimal shrinkage. This system is 100% reactive and contains no solvents or diluents. The cured elastomer is an excellent electrical insulator. It also resists thermal cycling well and stands up to a variety of chemicals.

EP30D-7 has an impressive tensile strength of greater than 1,600 psi, a Shore A hardness of 90, an elongation of more than 40%, and a dielectric constant exceeding 400 volts/mil. It is resistant to thermal cycling and chemicals including water, fuels, and inorganic solvents even at high temperatures. It is available for use in pint, quart, gallon, and 5 gallon containers kits.

New Low Viscosity Adhesive/Sealant Cures at Room Temperature

Master Bond Inc., Hackensack, NJ has developed a new, easy to use, two component epoxy adhesive for high performance bonding applications called EP30. It develops outstanding physical strength properties even when cured at ambient temperatures. Cure can be accelerated by use of moderate heat. EP30 features very low viscosity along with outstanding chemical resistance, dimensional stability, hardness and superb optical clarity. Electrical insulation properties are superior even upon prolonged exposure to moisture. EP30 is widely used in potting and encapsulating electronic components as well as in bonding optical elements. For medical applications, a USP Class VI approved version called EP30MED is also available.

Master Bond EP30 has excellent adhesion to a wide variety of substrates including metals, ceramics, glass and many plastics. Typically, the lap shear strength exceeds 3,000 psi for aluminum to aluminum bonds. EP30 also has exceptionally low shrinkage upon cure. It is especially suited for assemblies where only very thin bond lines are dictated by design considerations.

Master Bond EP30 is available in 1/2 pint, pint, quart, gallon and 5 gallon kits. It is also available in gun applicators and double pouch divider packs for ease of application.

Epoxy Cures at Low Temperature

Achievement of high performance cures at low temperatures has long been a problem for epoxy resin compositions. Master Bond Inc. has successfully overcome this problem with a newly developed epoxy resin system called Master Bond EP27. In 6 mil thick films, EP27 will set in as little as 2 hours at only 40°F and will cure in 48-72 hours.

Master Bond EP27 has a convenient non-critical mix ratio of 2 to 1 by weight or volume and a desirable low mixed viscosity of only 2000 cps. The cured epoxy resin system offers outstanding physical strength properties and excellent chemical resistance. Specifically, EP27 features unmatched long term resistance to immersion in such aggressive solvents as ethanol, toluene, butyl cellosolve, 70% sulfuric acid, 30% nitric acid, 50% sodium hydroxide and bleaches. It also has high bond strength to metallic and non metallic substrates.

Silver Conductive Epoxy Meets NASA Low Outgassing Standards

Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries.

The adhesive cures at room temperature in 24-48 hours and in just 1-2 hrs at 200ºF, producing tough high strength bonds. It features a tensile shear strength of more than 1,800 psi, a T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4K to 275ºF, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents.

The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a 3 month shelf life and glass jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.

Toughened Two Part Epoxy Adhesive/Sealant Meets NASA Low Outgassing Specifications

Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue. It meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications. EP21TDCHT-LO has a convenient mix ratio of 1:1 by weight or volume and is formulated to cure at room temperature or more rapidly at elevated temperatures.

As a toughened system, EP21TDCHT-LO is particularly well suited for bonding dissimilar substrates, especially when they have differing coefficients of expansion. It has an outstanding service temperature range from -100ºF to +350ºF. Other notable features include a shear strength exceeding 2500 psi, a peel strength of greater than 20 pli, and a Shore D hardness of greater than 60. The cured epoxy has excellent chemical resistance and is an electrical insulator.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

Adhesive resists up to 400°F

Master Bond Inc., Hackensack, N.J. is proud to announce the development of a new two component, room temperature curing epoxy adhesive called EP21HT. This system is easy to use and has a convenient, forgiving 1 to 1 mix ratio by weight or volume. EP21HT is 100% reactive and contains no solvents or volatiles. It has excellent physical strength properties and bonds well to both similar and dissimilar substrates. These include metals, glass, ceramics, wood, rubbers and many plastics. EP21HT has a service operating temperature range of -60°F to 400°F.

Once cured, EP21HT possesses superb electrical insulation properties. It has a volume resistivity of >1014 ohm-cm. It is also capable of withstanding exposure to thermal cycling and many chemicals including water, oils, fuels, acids, bases and salts. It has a Shore D hardness of >70 and coefficient of thermal expansion of 50 in/in x 10-6/°C. It has a tensile strength of >8,000 psi and a tensile modulus of >350,000 psi.

Master Bond EP21HT fully meets the requirements of MIL-A-81236 (OS) and MMM-A-187B. In addition, it conforms to Title 21, U.S. Code of Federal Regulations, FDA, Chapter 1, Section 175.105 and 175.300 for food compatibility.

EP21HT is available in pint, quart, gallon and 5 gallon container kits. For ease of use, it is also available in convenient syringe and gun applicators.

Low to Moderate Viscosity, Toughened Two Component Epoxy System for High Performance Casting, Bonding and Sealing

Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to +250ºF.

The typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B. This system produces high strength castings, bonds and seals which are remarkably resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi and its tensile strength normally exceeds 1,100 psi.

The hardened compound is an electrical insulator with a volume resistivity greater than 1012 ohm-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.

EP21FL is available in half pint, pint, quart, one gallon and five gallon container kits.

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