OEM

One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard

p>Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver filled system, it exhibits high electrical conductivity (volume resistivity < 0.001 ohm-cm) and excellent thermal conductivity. This epoxy passes ISO 10993-5 for cytotoxicity and is designed for high-speed medical device manufacturing.

EP3HTSDA-2Med cures quickly with heat. Cure schedule options include heating at 250°F for 20-30 minutes or 300°F for 5-10 minutes, with an optional post cure to optimize overall performance properties. The system bonds well to many substrates, including but not limited to metals, ceramics, plastics, and silicon dies.

EP3HTSDA-2Med has an excellent physical strength profile. It provides a tensile strength of 3,000-4,000 psi and a tensile modulus of 200,000-250,000 psi. It has a thermal conductivity of 45-49 BTU•in/(ft2•hr•°F) [6.5-7 W/(m·K)]. The filler particles used in this epoxy are exceptionally small, averaging 2-3 microns, and no larger than 25 microns. This allows for very thin bond lines, thereby providing effective heat transfer since it can offer a very low thermal resistance of 2-3 x 10-6 K•m2/W. This epoxy resists many sterilization methods such as glutaraldehyde, ethylene oxide (EtO) and gamma radiation.

The system is available in EFD® syringes for automated dispensing or glass jars in 20 grams, 50 grams, 100 grams, 1 pound and multiple pounds.

Toughened, UV Curable Adhesive Features Optical Clarity

Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a UV light source emitting at a wavelength of 320-365 nm. The material can also be cured in sections up to 0.125 inch thick under appropriate conditions, making it suitable for bonding, sealing, coating, and encapsulation.

UV15-7HP has a strong performance profile, featuring a tensile strength of 6,000-7,000 psi and a tensile modulus of 250,000-300,000 psi at room temperature. This toughened system resists thermal cycling and offers significant elongation of 5-10%. It is an electrically insulative material with a volume resistivity greater than 1014 ohm-cm. Optically clear with a refractive index of 1.54 at 589 nm, it is not oxygen inhibited and contains no solvents or diluents.

UV15-7HP bonds well to a wide variety of substrates including glass, ceramics, metals and many plastics, such as polycarbonates, acrylics and polyester films. This system is serviceable in a wide range of temperatures from -80°F to 300°F. It is available in various packaging options: 10cc and 30cc syringes, ½ pints, pints, quarts, gallons, and 5-gallon containers.

Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation

Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from 4K to 250°F.

EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10-6 in/in/°C, a tensile strength of 6,000-8,000 psi, and a Shore D hardness of 70-80. This system has a volume resistivity exceeding 1015 ohm-cm at 75°F and a dielectric constant of 4.2 at 60 Hz. A key performance attribute is its ability to withstand temperature cycling even at cryogenic levels.

EP29LPSPND-3 has a mix ratio of 100:65 by weight with a long working life after mixing; a 100-gram batch will yield an open time of greater than 5 hours at 75°F. The color of Part A is clear-translucent, and Part B is amber-clear; it cures clear when applied in thin sections despite being a paste, with a refractive index of 1.56 at 589 nm. The recommended cure schedule is either 12-18 hours at 130-150°F or a faster 5-10 hours at 150-165°F. EP29LPSPND-3 is available in ounce jar kits, half pint kits, pint kits, quart kits, and gallon kits.

Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light

Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without oxygen inhibition upon exposure to 405 nm LED light, followed by a short 30-45 minute heat cure at 90-95°C, making it well-suited for bonding heat sensitive components. LED415DC90Med passes ISO 10993-5 requirements for non-cytotoxicity and resists common medical sterilants, including glutaraldehyde, peracetic acid, ethylene oxide, and gamma radiation.

Unlike conventional dual cure adhesives that limit light penetration to approximately 1 mm, LED415DC90Med can partially cure or fixture sections up to 6 mm deep when exposed to 405 nm LED light at the appropriate intensity and for a sufficient duration. This deeper cure capability enables the fixturing of opaque components by allowing light penetration through the adhesive from the sides. A subsequent cure at 90-100°C for 30-60 minutes is recommended to optimize strength and overall performance.

LED415DC90Med has a thixotropic index of 5.53 at room temperature. It exhibits a tensile strength of 5,500-6,500 psi, a tensile modulus of 450,000-550,000 psi, and a lap shear strength exceeding 1,000 psi (aluminum to aluminum). This rigid system cures to a Shore D hardness of 85-90 with an elongation of 1-3% at 75°F. It is serviceable from -80°F to +350°F, electrically non-conductive (volume resistivity > 1014 ohm-cm), and bonds well to a variety of substrates, including plastics, glass, and metals. LED415DC90Med is available in syringes, ½ pint, pint, and quart containers.

Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications

Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. The epoxy is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperature. This filler size and its relatively flowable viscosity enable the EP53TC epoxy to fill small voids making it ideal for heat dissipation.

EP53TC meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm. The material offers a thermal resistance of 10-15 x 10-6 K•m2/W and a thermal conductivity of 2.3-2.6 W/(m•K). This epoxy exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater than 1,000,000 psi, and a Shore D hardness of 85-95. The service temperature range is from -100ºF to +300ºF (-73ºC to +149ºC).

A moderate heat cure is required to achieve optimal properties with EP53TC. The recommended cure schedule is 2 hours at 80ºC followed by a post-cure of 90-120 minutes at 125ºC. This epoxy is available in various packaging options, including ounce kits, quarter pint kits, half pint kits, pint kits, and quart kits.

Toughened, Non-Drip Epoxy Features High Glass Transition Temperature

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme 121AOND not only provides excellent chemical resistance, but also offers a high glass transition temperature (Tg) of 200-210°C. It meets NASA low outgassing specifications per ASTM E595 testing.

This epoxy has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. It possesses high bond strength with a tensile strength of 6,000-7,000 psi and a tensile modulus of 750,000-850,000 psi, at room temperature. Supreme 121AOND retains its strength profile even at high temperatures with a tensile modulus of 650,000-750,000 psi at 300°F. Its thermal conductivity measures 4-5 BTU•in/(ft²•hr•°F) [0.58-0.72 W/(m•K)] and it offers a wide service temperature range from -80°F to +550°F [-62°C to 288°C].

Supreme 121AOND cures at elevated temperatures and has a long working life of 2-3 days. A typical cure schedule is 1-2 hours at 200-210°F followed by 3-4 hours at 250°F, and another 4-6 hours at 300°F. Additional post curing at 350-400°F for 2-4 hours will further enhance product properties. Although the cure schedule is not rapid, the key benefit conferred by this system is high structural strength even at elevated temperatures. The system bonds well to a wide variety of substrates including glass, fibers, metal, ceramics, rubbers and plastics. Part A is black, Part B is dark brown. It is available in standard packaging ranging from ½ pint kits to 5 gallon kits.

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies will yellow over time, especially upon exposure to heat and intense UV light, EP21LSCL-2Med has been designed to resist yellowing to a greater extent than conventional systems. This unique feature makes it ideal for imaging applications or other medical devices where optical clarity is needed.

EP21LSCL-2Med is an optically clear compound with a refractive index of 1.57. It has a high glass transition temperature of 110-120°C and a service temperature range of -60°F to +350°F (-52°C to +177°C). This system has a 100:20 mix ratio by weight, and a low mixed viscosity of 600-900 cps at room temperature. It is a moderate heat cured epoxy which features an exceptionally long gel time of 6-8 hours at room temperature for a 100-gram batch. EP21LSCL-2Med cures at room temperature followed by a post cure of 3-5 hours at 140-175°F (60-80°C).

EP21LSCL-2Med adheres well to many substrates including but not limited to metals, composites, glass, ceramics, and plastics. It offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 325,000-375,000 psi. This epoxy resists many sterilization methods such as steam sterilization, liquid sterilants, anti-bacterial agents, and Ethylene Oxide.

The shelf life of EP21LSCL-2Med is 6 months in its original, unopened containers, and it is available in kits ranging from ½ pints to 5 gallon pails, as well as specialty packaging in pre-mixed and frozen syringes requiring storage at –40°C.

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.

EP3HT-LO features a good strength profile, with a lap shear strength of 1,600-1,800 psi, a tensile strength of 5,000-6,000 psi and a tensile modulus of 250,000-300,000 psi. It withstands 1000 hours of 85°C/85% RH exposure. This formulation offers reliable electrical insulation properties with a dielectric constant of 3.9 at 60 Hz and a volume resistivity of greater than 1014 ohm-cm, at room temperature. EP3HT-LO withstands a variety of chemicals such as water, oils, fuels, acids and bases. This high temperature resistant system is serviceable from -60°F to +400°F (-51°C to 204°C).

As a one-part compound, EP3HT-LO offers convenient handling and processing. It cures with heat, quickly polymerizing in as little as 5-10 minutes at 300°F (~ 150°C). This epoxy bonds well to metals, glass, composites, ceramics and many plastics. EP3HT-LO is available for use in ½ pints, pints, quarts, gallons and syringes. It has a shelf life of 6 months at ambient temperatures in original, unopened containers.

Non-Drip Epoxy Features Acid Resistance

Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% phosphoric acid, and 15% nitric acid, by soaking cured samples for more than 12 months”, says Senior Product Engineer Rohit Ramnath. “The product also passes the damp heat reliability testing by withstanding 1000 hours of 85°C and 85% Relative Humidity (RH).”

Although EP21ARHTND-2 is capable of curing at room temperature, to optimize its acid resistance properties, a cure schedule of overnight at ambient temperatures, followed by a heat cure of 150-200°F for 2-4 hours or longer is typically recommended. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F for a 1/8-inch test specimen. Other noteworthy properties include a tensile strength of 9,000-10,000 psi, and a Shore D hardness of 75-85. The adhesive provides good heat resistance and is serviceable from -60°F to +400°F.

EP21ARHTND-2 does not contain solvents and is RoHS compliant. The product bonds well to metals, ceramics, composites, rubbers and plastics. It features a smooth paste-like consistency and will not flow, or sag once applied, making it ideal for bonding and sealing applications. It is available for use in ½ pint, pint, quart and gallon container kits. Specialty packaging can also be provided in 50 ml (cc) double barrel cartridges, which not only eliminates the need for manual measuring as well as mixing, but also enables the possibility of manual or automated dispensing.

Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications

Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since it has a relatively long working life of 60-90 minutes (at room temperature for a 100-gram batch). This makes it uniquely suited for demanding situations where more time for fixturing is needed.

Supreme 11AOHTLP has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. It also exhibits thermal conductivity of 3-5 BTU·in/(ft²·hr·°F) [0.5-0.7 W/m/K]. The system provides high bond strength properties with a lap shear strength of 3,200-3,400 psi, a tensile strength of 7,000-8,000 psi, a compressive strength of 20,000-22,000 psi and a T-peel strength of 15-20 pli. This toughened formulation is designed to withstand thermal cycling and offers a wide service temperature range from -112°F to +400°F (-80°C to 204°C).

Supreme 11AOHTLP cures at room temperature in 2-3 days, and faster with heat, in 2-3 hours at 200°F. To optimize properties, the recommended cure schedule is overnight at room temperature, followed by a post cure at 120-150°F for 3-4 hours. It bonds well to a wide variety of substrates including metals, ceramics, glass, rubbers, and many plastics. This epoxy system has a convenient 1:1 mix ratio by weight, with the mixed material being a thixotropic paste. To eliminate the need for manual measuring and mixing, it can be packaged in double barrel cartridges for gun kits. It is also available in standard jars and cans, ranging in size from ½ pint to gallon containers.

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