The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices.In this white paper, we explore various polymer chemistries and what the different families of compounds have to offer for performance and processing requirements.
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties.
Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.
As technology in the optics industry continues to advance and improve, careful consideration of the properties of epoxies must be evaluated. When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be assessed.
Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you navigate the more common dilemmas associated with the selection and application of epoxy potting compounds.