Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.

As technology in the optics industry continues to advance and improve, careful consideration of the properties of epoxies must be evaluated. When determining the most effective adhesive to be used in opto-electronics, medical and other optic related industry applications, trade-offs of key characteristics should be assessed.

Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you navigate the more common dilemmas associated with the selection and application of epoxy potting compounds.

Film adhesives are an alternative to liquid adhesives. Read more about the advantages that these unique epoxies offer and why they are often preferred over their conventional counterparts. If your application involves a large surface to be joined or if squeeze out may pose a problem, download this white paper today.

Adhesives in space applications are subject to high vacuum and extreme temperatures, making adhesive choice a critical design consideration. Learn how low outgassing epoxies satisfy these stringent conditions ensuring reliable space applications.

Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications. Learn more about their functional benefits and what to consider when choosing an adhesive for use in thermal cycling applications.

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