As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification.
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices.
What are the factors to consider when you need to maximize adhesive bonding performance? In this white paper, Master Bond explores the different joint designs, surface preparations, polymer types and performance properties to consider when using structural polymer adhesives to join different parts together.
Selecting the right adhesive product for extreme temperature applications may seem as straightforward as reading temperature resistance values on data sheets. Some engineers will sometimes address temperature issues by simply selecting an adhesive rated for temperatures beyond their application's expected operating temperature.