As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.
Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, including one and two part epoxies, one and two part silicones, cyanoacrylates and UV curables.
Master Bond’s paper offers a guide to evaluating and selecting adhesive products exposed to harsh chemical environments. This article examines the importance of exposure variables, chemical interactions, testing and includes practical suggestions of procedures on how to avoid generalities in the selection process.
What are the factors to consider when you need to maximize adhesive bonding performance? In this white paper, Master Bond explores the different joint designs, surface preparations, polymer types and performance properties to consider when using structural polymer adhesives to join different parts together.
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices.