Adhesives in space applications are subject to high vacuum and extreme temperatures, making adhesive choice a critical design consideration. Learn how low outgassing epoxies satisfy these stringent conditions ensuring reliable space applications.

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties.

Polyethylene, polypropylene and related polyolefin blends and alloys have a reputation for being difficult to bond with conventional adhesives. However, advances in adhesive chemistry have made it possible to bond polyolefins effectively without the need for surface treatments. Learn more about the best practices for selecting the right adhesive for polyolefin bonding.

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.

Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, including one and two part epoxies, one and two part silicones, cyanoacrylates and UV curables.

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