As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.
Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties.
Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, including one and two part epoxies, one and two part silicones, cyanoacrylates and UV curables.
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification.
Master Bond’s paper offers a guide to evaluating and selecting adhesive products exposed to harsh chemical environments. This article examines the importance of exposure variables, chemical interactions, testing and includes practical suggestions of procedures on how to avoid generalities in the selection process.
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices.