Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, including one and two part epoxies, one and two part silicones, cyanoacrylates and UV curables.
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification.
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices.
Selecting the right adhesive product for extreme temperature applications may seem as straightforward as reading temperature resistance values on data sheets. Some engineers will sometimes address temperature issues by simply selecting an adhesive rated for temperatures beyond their application's expected operating temperature.
UV curable adhesives are among the most user friendly adhesive products on the market today—if you know how to apply them. We invite you to take a closer look at the capabilities of UV curable formulations, the requirements for an optimal cure and the best applications for these versatile 100% reactive adhesives.
What are the factors to consider when you need to maximize adhesive bonding performance? In this white paper, Master Bond explores the different joint designs, surface preparations, polymer types and performance properties to consider when using structural polymer adhesives to join different parts together.