The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties.
The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices. In this white paper, we explore various polymer chemistries and what the different families of compounds have to offer for performance and processing requirements.
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces.
Adhesives in space applications are subject to high vacuum and extreme temperatures, making adhesive choice a critical design consideration. Learn how low outgassing epoxies satisfy these stringent conditions ensuring reliable space applications.
Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications. Learn more about their functional benefits and what to consider when choosing an adhesive for use in thermal cycling applications.
Breakthroughs in adhesive technology enable light curing adhesives to cure under a visible light wavelength of 405 nanometers. Learn how these environmentally friendly adhesives can improve worker safety and lower production costs while offering a range of desirable engineering properties ideal for many applications.