Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and longevity of the devices we use in our everyday lives.
Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal conductivity, to name a few.
Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.
Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you navigate the more common dilemmas associated with the selection and application of epoxy potting compounds.
The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices. In this white paper, we explore various polymer chemistries and what the different families of compounds have to offer for performance and processing requirements.
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties.