As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability.
The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vibration, and other physical damage.
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used.
One of the most effective approaches to prevent and inhibit corrosion of metals is to create a protective barrier over the component. This is most easily achieved with the use of a coating compound. Coatings protect against corrosion, moisture and other chemicals from attacking metal parts.
Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers and other variables are considered in this paper.
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured.