Adhesives for Bonding Copper Substrates

Copper is a ductile metal featuring high thermal and electrical conductivity. It offers toughness, high tensile strength and low thermal expansion. It is also noted for its heat and corrosion resistant properties. Copper has an attractive color, is 100% recyclable and is antimicrobial.

Specific applications include the manufacturing of:

  • Auto parts
  • Industrial controls
  • Pumps
  • Industrial valves
  • Heat exchangers
  • Electrotherapeutic apparatus
  • Thin film disposition equipment
  • Fluid power cylinders
  • Railroad equipment

Master Bond epoxy and polyurethane adhesive bonding compounds are frequently employed for adhering copper to copper and copper to dissimilar substrates.

Read our guide to learn more about proper surface preparation for bonding metals.

Consideration for Bonding Copper Substrates - Thermal Stability

Frequently used, high temperature resistant grades include EP21HT, EP21TDCHT, EP3HT and Supreme 46HT-2ND-2. EP21HT has a convenient one to one mix ratio and cures at room temperature. Toughened, EP21TDCHT has superior dimensional stability, withstands thermal cycling and has dependable electrical insulation properties. EP3HT is a single part compound that cures rapidly at moderate elevated temperatures. Two component, non-drip Supreme 46HT-2ND-2 has high peel and shear strength. Chemically resistant, it retains its high performance after long term exposure to 500°F.

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