OEM

NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance

EP42-2LV Black is a two part epoxy with low viscosity and good flow. It withstands prolonged immersion in many acids, bases, solvents, fuels and oils. This versatile system can be used for bonding, sealing, coating and casting, where a strong chemical resistance profile is required.

This compound has an easy to use mix ratio of 100 to 40 by weight or 100 to 50 by volume with Part A being black and Part B being light amber. The viscosity of the mixed system is around 1,000-2,000 cps, and it has a long working life of 60 to 90 minutes per 100 gram batch. EP42-2LV Black cures optically opaque at room temperature in 2 to 3 days or at elevated temperatures of 200°F in 2 to 3 hours. For optimal performance, the recommended cure schedule is overnight at room temperature followed by heat curing at 150-200°F for 2 to 4 hours.

It meets NASA low outgassing specifications and is serviceable over a wide temperature range from -60°F to 350°F. This system is electrically insulative with a volume resistivity greater than 1014 ohm-cm and a dielectric constant of 4.0 at 60 Hz, at room temperature. These attributes, combined with its relatively long working life and lower exotherm, make EP42-2LV Black suitable for many larger potting and encapsulation applications.

EP42-2LV Black is recommended for applications in aerospace, electronic, optical and OEM industries. It is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is also available in gun dispensers and premixed and frozen syringes.

How to Manage Stresses Caused By CTE Mismatches

Stress management is critical for adhesive applications, mainly due to the possibility of a CTE (coefficient of thermal expansion) mismatch between the substrates being bonded, and between the substrates and the adhesive.

Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity

Master Bond EP40Med, a two part epoxy system, combines toughness and a low tensile modulus while still providing a relatively high lap shear strength. It meets the requirements of ISO 10993-5 testing and is therefore considered to be non-cytotoxic. This compound can be used for bonding, sealing, coating and encapsulating.

EP40Med resists sterilization to gamma, EtO, chemicals, and liquid disinfectants. It is recommended for use in medical device manufacturing and repair for both disposable and reusable instruments. EP40Med is an effective adhesive for applications where toughness and flexibility along with good structural strength are needed. The formulation bonds well to polycarbonates, acrylics, metals, ceramics and composites. This flexible epoxy has an elongation of 80-90%, a lap shear strength of 1,600 to 1,800 psi and a low tensile modulus of 1,000 to 1,500 psi. EP40Med is a reliable electrical insulator with a volume resistivity over 1012 ohm-cm.

This system is easy to use with a one to one mix ratio by weight or volume and a low to moderate viscosity of both parts A and B. The working life of a mixed 100 gram batch is approximately 120-150 minutes. The optimal cure schedule is overnight at room temperature followed by a post cure for 2-3 hours at 150°F. The product is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is available in gun dispensers and premixed and frozen syringes.

Epoxy Features Exceptional Chemical and Heat Resistance

Master Bond EP35SP is a two part epoxy system for bonding and sealing applications, providing resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals. It features both a high glass transition temperature (Tg) and a broad service temperature range. Its Tg measures 215-220°C and its serviceability extends from -62°C to +288°C (-80°F to 550°F).

EP35SP has notable dielectric properties with a dielectric constant of 4.5 at 60 Hz and a volume resistivity greater than 1014 ohm-cm. It bonds well to a wide array of substrates including metals, several plastics, ceramics, glass and composites. Upon curing, this system offers low shrinkage and good dimensional stability. Its tensile modulus is 550,000-600,000 psi with an overall superior physical strength profile even under adverse environmental conditions.

EP35SP has a paste viscosity, with little to no flow, and can be applied on vertical surfaces. The mix ratio is an easy to use 100 to 50 by weight. The system has a long working life of 24 to 48 hours. For optimal properties, the recommended cure schedule is 1 hour at 110°C followed by 2-3 hours at 125-150°C, plus a post cure at 175°C for 2-3 hours. Due to its high temperature resistance and structural properties, EP35SP may be considered for bonding and sealing in downhole, aerospace, electronic, optical and specialty OEM applications. Other uses may apply as well. The product is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature

Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver. However, with this specialty formulation, a high Tg of 140-150°C is maintained and it passes MIL-STD-883J thermal stability requirements at 200°C.

Its strength profile is also notably robust with a die shear strength of 35-40 kg-f at room temperature. EP17HTS-DA meets NASA low outgassing specifications and its service temperature extends from -80°F to 550°F. It has a low volume resistivity of less than 0.005 ohm-cm and also performs well as a heat conductor.

EP17HTS-DA is a thixotropic paste and can be easily dispensed manually or via automated dispensing systems. This compound is not premixed and frozen and has an unlimited working life at room temperature. It requires a heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.

This product bonds well to many substrates including metals, ceramics and plastics. It is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 grams to several pounds.

Tough Epoxy Polysulfide Adhesive Resists High Temperatures

Master Bond EP21TPHT is a new two component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient handling characteristics with a 1 to 1 mix ratio by weight or volume and an easily flowable mixed viscosity of 5,000-15,000 cps.

“EP21TPHT offers a high lap shear strength of 1,600-1,800 psi and bonds well to a variety of substrates including metals, composites, glass, ceramics, and many rubbers. It is a toughened compound with good elongation of 20-40%, and a relatively low tensile modulus of 30,000-50,000 psi at room temperature”, says Rohit Ramnath, Senior Product Engineer. “This combination of properties makes it suitable for applications involving thermal cycling and mechanical stresses.”

EP21TPHT is an electrically insulative material with a dielectric constant of 3.9 and volume resistivity of more than 1014 ohm-cm at 75°F. It withstands exposure to a wide range of chemicals including but not limited to fuels, oils, hydrocarbons and hydraulic fluids. EP21TPHT offers a unique combination of performance properties advantageous in many applications in the aerospace, military, electronic, electrical, and specialty OEM industries. This product is available for use in double barrel syringes and gun dispensers, as well as in ½ pint, pint, quart or gallon container kits.

Adhesives and Coatings for Assistive Technology

Adhesive Formulations for Assistive TechnologyMaster Bond Inc. formulates numerous adhesive grades for the assembly of equipment, tools, devices, products for individuals possessing a disability or impairment.

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Crystallization and Epoxies

Epoxies containing crystals prior to mixing and curing are a relatively infrequent occurrence. With two part systems, crystals may appear in Part A or less frequently, in Part B. It is most likely to occur upon exposure to relatively colder temperatures during shipping or while in storage. Due to crystallization, the viscosity of the epoxy could increase.

Toughened, Urethane Based Epoxy System Meets USP Class VI Specifications

Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements while also complying with RoHS3 in accordance with the EU directive 2015/863/EU. EP30DPBFMed is resistant to thermal cycling and sterilization, withstanding exposure to gamma radiation, e-beam, EtO, as well as other liquid sterilants.

Its low viscosity of 3,000 to 6,000 cps for Part A, and 200 to 500 cps for Part B, makes it readily pourable and ideal for potting and casting. EP30DPBFMed has a long working life of 60 to 90 minutes per 100 grams mass at 75°F, and features a low exotherm during the curing process. The system contains no solvents or diluents.

Due to the addition of a urethane based flexibilizer, EP30DPBFMed offers both a higher abrasion resistance and a higher elongation when compared to a typical epoxy system. At room temperature, it has an elongation at break of 20 to 40%, and Shore D hardness of 30 to 50. It is useful in applications where low stress is important, due to its low modulus value. This compound is electrically insulative with a volume resistivity greater than 1014 ohm-cm. EP30DPBFMed is serviceable over a wide temperature range from cryogenic 4K to 250°F.

This formulation is available for use in a variety of standard packaging options ranging in size from ounce kits to gallon kits. Specialty packaging in premixed & frozen syringes, and gun applicators with double barrel cartridges is also available.

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation

Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need excessive heat for curing and has a long working life at room temperature. This system is electrically insulative and thermally conductive with very fine particle size filler material. EP29LPTCHT can be easily dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12-15 x 10-6 K•m2/W.

EP29LPTCHT features excellent flow properties with an initial mixed viscosity of 5,000-15,000 cps. It offers a long working life after mixing, for example a 100 gram batch at 75°F will yield an open time of 10-12 hours. EP29LPTCHT has a thermal conductivity of 9-10 BTU•in/(ft2•hr•°F) and a volume resistivity of more than 1015 ohm-cm, both measured at 75°F.

The recommended cure schedule is overnight at room temperature followed by 4-5 hours at 160°-180°F. This noteworthy processing characteristic makes it ideal for substrates which are heat sensitive. After curing EP29LPTCHT features an exceptionally low coefficient of thermal expansion of 22-24 x 10-6 in/in/°C along with a compressive strength of 24,000-26,000 psi and a hardness of 80-90 Shore D. It is available in premixed and frozen syringes, 1/2 pint kits, pint kits, and quart kits. The color of Part A is off white and the color of Part B is white.

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