OEM

What are the mold release options for casting with an epoxy?

Epoxies are thermoset polymers with impressive physical strength, temperature, and chemical resistance among many other desirable properties. They have many functions not just limited to bonding, sealing, and coating, but also for casting applications.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications. However, this system can also be utilized for encapsulation and bonding. Supreme 3CCM-85 cures within 2-3 hours at 175-185°F [80-85°C], which is advantageous for use on heat sensitive components and substrates.

Supreme 3CCM-85 is a toughened adhesive system, that bonds well to a variety of similar and dissimilar substrates. It has a high volume resistivity of more than 1014 ohm-cm and a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m•K)]. The system is serviceable from -100°F to +350°F [-73°C to +177°C].

Since Supreme 3CCM-85 is not premixed and frozen and has a very long open time at room temperature, it is more convenient to handle and store than typical two component glob top systems. This opaque black compound has a thixotropic paste-like consistency and is easy to apply either manually or with an automated dispenser. Master Bond Supreme 3CCM-85 is available for use in common size syringes ranging from 10 cc to 30 cc as well as in standard size containers.

Adhesives for E-Mobility Applications

Adhesive, sealant and coating compounds for e-mobility applicationsClean, efficient, environmentally friendly electric vehicles, hybrid electric vehicles and hydrogen fuel cell technology has made major strides in reducing the need for fossil fuels, lowering carbon gas emi

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Epoxy Adhesives for Threadlocking

Threadlocking application Master Bond epoxy adhesive systems have proven advantageous for unique threadlocking applications. They have been frequently used in severe environments and are noted for their impressive strength, chemical resistance and thermal stability.

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Optically Clear, Low Viscosity Epoxy System Features High Flexibility

Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy to use, with a mixing ratio of one to one by weight or volume.

EP88FL withstands thermal cycling and shock. It is ideal in applications where stress relief is needed with a tensile modulus ranging from 10,000 psi to 20,000 psi. This system provides an elongation of 30-50% and bonds well to a wide variety of substrates such as metals, ceramics, plastics and glass. Despite curing with a good degree of flexibility, it cannot be considered soft since it has a Shore D hardness between 45-55 at 75°F. The refractive index is 1.51 at 589 nm, making the system relevant for applications in optics, opto-electronics, aerospace and OEM.

The mixed viscosity of EP88FL is 800-1,200 cps at room temperature, and its working life is 20-30 minutes for a 100 gram batch. EP88FL can be cured at room temperature or elevated temperatures. The optimal cure is overnight at 75°F plus 1 to 2 hours at 150-200°F. Master Bond EP88FL is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including FlexiPaks®, syringes and gun dispensers.

Microfluidic Devices

Adhesives, sealants and coatings for the assembly of microfluidic devicesMicrofluidic technologies are employed in a wide range of applications and scientific experiments, particularly in the life sciences, as an important tool for analysis and controlling of fluids.

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Meters

Adhesives, sealants and coatings for the assembly of metersThese valuable measuring devices have kept pace with new technological requirements with the aid of Master Bond bonding, sealing, coating formulations.

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Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance

Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. “This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer. “As a toughened system, it is ideal for bonding dissimilar substrates. Supreme 17HT’s unique combination of properties makes it suitable for applications involving repeated exposure to thermal cycling.” It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HT possesses high bond strength properties with lap shear strength of 1,900-2,100 psi and tensile strength of 7,000-8,000 psi. This system is a reliable electrical insulator with volume resistivity of over 1015 ohm-cm at ambient temperatures and over 1012 ohm-cm at 400°F. It is serviceable from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, Supreme 17HT offers a moderate viscosity of 100,000-150,000 cps.

Supreme 17HT cures at elevated temperatures with cure schedule options including 300°F for 5-6 hours or 350°F for 4-5 hours. It is available in standard packaging ranging from ½ pint to 5 gallon containers as well as specialty packaging including cartridges and syringes.

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements

Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal for many applications in the medical device industry.

As a nanosilica filled system, UV22DC80-1Med offers low shrinkage upon cure, excellent abrasion resistance and dimensional stability with a low coefficient of thermal expansion of 30-35 x 10-6 inch/inch/°C. It is a reliable electrical insulator with volume resistivity of more than 1014 ohm-cm and dielectric constant of 3.85 at 60 Hz. UV22DC80-1Med is optically clear with a refractive index of 1.52.

The UV curing process for UV22DC80-1Med takes only 10-30 seconds at a 365nm wavelength and 10-40 mW/cm2 of UV output. The heat curing process can be initiated at 80°C, making it highly desirable in applications involving heat sensitive components. Optional post curing at 125-150°C for 15-30 minutes will increase the glass transition temperature to over 125°C. This system is not oxygen inhibited.

UV22DC80-1Med has a low viscosity of 500-3,500 cps at 75°F (~ 23°C). It bonds well to a variety of substrates including metals, glass, ceramics and most plastics. This compound has very good resistance to various sterilization methods including autoclaving and many chemical sterilants. It is available for use in 30 cc EFD syringes, ½ pint, pint, and quart containers.

Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability. EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft2•hr•°F) [5.5 W/(m•K)] at room temperature while its compressive strength measures 22,000-24,000 psi upon cure. It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85-95.

According to Rohit Ramnath, Senior Product Engineer, "EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles." This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures. Part A has a thick paste consistency and Part B is a low viscosity liquid.

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, 1/2 pint kits, and pint kits.

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