OEM

Silver Conductive, One Component Epoxy Cures at 80°C

Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature. “While typical heat activated epoxies require 250°F to 350°F to cure, Supreme 3HTS-80 cures at 175°F to 185°F within 2-3 hours” says Rohit Ramnath, Senior Product Engineer. “Curing at such temperatures makes this system advantageous for bonding applications involving heat sensitive substrates.”

Supreme 3HTS-80 has a volume resistivity of less than 0.05 ohm-cm. Upon curing, it exhibits a hardness of 50-60 Shore D and a high thermal conductivity over 20-25 BTU•in/(ft2•hr•°F) [2.9-3.6 W/(m•K)]. This 100% reactive epoxy bonds well to metals, composites, glass, ceramics, and many plastics. As a toughened system, Supreme 3HTS-80 can withstand thermal cycling and shock with a service operating temperature range from -100°F to +350°F [-73°C to +177°C].

Supreme 3HTS-80 is a thick paste with a specific gravity of 3.9 that can be readily dispensed from a syringe. Storage in a conventional refrigerator is recommended as this system does not require freezing. This compound is packaged in syringes or glass jars with common sizes including 20 grams, 50 grams, 100 grams, 1 pound and multiple pound units.

Material Handling Equipment

Adhesives, sealants and coatings for the assembly of material handling equipmentFrom conveyor systems to automated guided vehicles to industrial forklifts to electric hoists to shiploaders Master Bond adhesives, sealants, coatings offer solutions for material equipment man

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Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm. EP93AOFR has an easy to use 1:1 mix ratio by weight and a good flow profile with a mixed viscosity of 30,000-150,000 cps.”

The Federal Aviation Regulations (FAR) Standard 14 CFR 25.853(a) test is typically used for determining material compatibility for various components inside aircrafts. This material has met and exceeded the requirements for the vertical ignition test where castings of the epoxy EP93AOFR were exposed to flames for 60 seconds. The results show that it took under 4 seconds to extinguish the flames, well under the allotted 15 seconds permitted by the test. The second part of this test measures how far the flame spreads. EP93AOFR exhibited a burn length of just 1.2 inches, well under the maximum allowed of 6 inches.

EP93AOFR bonds well to a variety of different substrates including metals, composites, glass, ceramic, FR4 and other plastics. It is serviceable from -80°F to +300°F [-62°C to +149°C] and offers good chemical resistance to water, fuels, oils, and many common solvents. This system is available for use in ounce, ½ pint, pint, quart and gallon kits. It can also be purchased in premixed and frozen syringes.

Biocompatible, Nanosilica Filled LED Curable Adhesive

Master Bond LED405Med is a one component, LED curing adhesive system that meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. “Since this system does not need a UV light for curing it is intrinsically more user friendly”, says Rohit Ramnath, Senior Product Engineer. “LED405Med has a nanosilica filler resulting in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10-6/°C. This product cures to a hardness of 65-75 Shore D, indicating that it is not too stiff, thereby offering good toughness.”

LED405Med is optically clear, with a refractive index of 1.50, and offers excellent light transmission properties. This electrically insulative system features a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps and can be used for bonding, sealing and coating. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405Med is serviceable from -60°F to +250°F and withstands gamma radiation as well as various chemical sterilants including EtO.

Benefits of Using Military Grade Adhesives in Non-Military Industrial and Research Applications

Some epoxy compounds successfully meet thermal stability testing standard ASTM D3850-12 per MIL-STD-883J Section 3.5.2 & 3.8.5 for military applications, however these systems can also be used across many other industries where thermal stability is an important requirement.

Low Viscosity, Thermally Conductive Underfill Epoxy

Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal for underfill and many bonding applications. EP3UF-1 delivers high bond strength and dimensional stability with a compressive strength of 18,000-20,000 psi and a tensile modulus of 450,000-500,000 psi.

EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)], making it an effective thermal interface material. It contains a special filler with a small particle size. This allows it to be applied in bond lines as thin as 10-15 microns imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. It offers superior electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen), both measured at 75°F.

As a single component system, EP3UF-1 is more convenient to handle, apply and store than typical two component adhesive systems. It has an unlimited working life at room temperature and cures in 20-30 minutes at 250°F, or in 10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30 cc syringes, which are compatible with automated dispensing systems.

Two Part, Addition Cured Fluorosilicone Offers Excellent Chemical Resistance

Master Bond MasterSil 980 is two part fluorosilicone system for high performance bonding, sealing, coating and potting applications. It withstands harsh chemicals such as gasoline, diesel fuel, motor oil, ethanol and many solvents. After testing, chemical resistance for MasterSil 980 was far superior when compared to standard type silicone systems.

With an elongation of 100-200% at 75°F, this fluorosilicone offers enhanced flexibility while maintaining resistance to aggressive thermal cycling and mechanical shock. It features a wide service temperature range from -85°F to +465°F. MasterSil 980 bonds well to a wide variety of substrates including metals, composites, ceramics, glass, rubbers, plastics as well as other silicones. This electrically insulative material has a dielectric constant of 6.4 (measured at 75°F, 60Hz) and a volume resistivity of more than 1014 ohm-cm.

Upon mixing, MasterSil 980 yields a moderate viscosity with good flow and a user friendly open time of 6-9 hours at room temperature for a 50 gram batch. As an addition cured system, it does not require air or humidity for cross-linking. It cures well in deep and wide sections making it ideal for use in various potting and encapsulation applications. With a hardness of 20-30 Shore A, it is also well suited for formed-in-place gasketing. MasterSil 980 can be utilized across many industries including aerospace, specialty OEM and chemical processing, among others.

Adhesives, Coatings & Sealants for Textile Machines

Adhesives for textile manufacturing equipmentHigh performance Master Bond adhesives, sealants, coating compounds have played an indispensable role in the assembly of high tech digital textile manufacturing equipment.

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One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component glob top systems. This black, heat curable compound has a flowable paste consistency ideal for glob top, chip coating and bonding applications. EP17HTND-CCM meets NASA low outgassing specifications and is serviceable from -80°F to +600°F [-62°C to +316°C]. This adhesive forms high strength bonds to a wide variety of similar/dissimilar substrates such as metals, ceramics, plastics, composites and various circuit board materials.

EP17HTND-CCM is thermally conductive and electrically non-conductive even upon exposure to hostile environmental conditions. EP17HTND-CCM has a high volume resistivity of more than 1015 ohm-cm at 75°F and over 1012 ohm-cm at 400°F. Its thermal conductivity is 9-10 BTU•in/ft2•hr•°F [1.4423 W/(m•K)] at 75°F. Also noteworthy is its ability to resist many chemicals including acids, bases, salts, fuels, oils and many solvents.

Formulated for various electronic applications, EP17HTND-CCM cures readily in 1-2 hours at 350°F [175°C] with a relatively low exotherm upon curing. It can be dispensed from a syringe, either manually or with an automatic dispenser. Master Bond EP17HTND-CCM is available for use in common size syringes ranging from 10 cc to 30 cc. For storage simple refrigeration at 40-45°F is recommended.

NASA Low Outgassing Rated UV Curing Adhesive with High Glass Transition Temperature

Master Bond UV26 is a new one part UV curable system featuring an exceptionally high glass transition temperature (Tg) ranging from 160 to 170°C. This NASA low outgassing certified compound also offers strong adhesion to a wide variety of substrates such as glass, surface treated metals and many plastics. As a coating and adhesive it is also capable of withstanding harsh chemicals including acids, bases, fuels and many aggressive solvents.

This low viscosity compound (250-1,500 cps at 75°F) cures rapidly upon exposure to a UV light source at a wavelength of 320-365 nm with an energy output as low as 20-40 milliwatts per cm2. With a refractive index of 1.55 at room temperature, this system features outstanding optical clarity. UV26 offers robust physical strength properties upon curing and is ideal for high performance bonding and coating applications. It features low shrinkage upon curing and serviceability from -60°F to +500°F [-51°C to +260°C].

Master Bond UV26 is 100% solids, does not contain any solvents or volatiles and is not oxygen inhibited. It is available for purchase in 10 cc and 30 cc syringes, ½ pint and 1 pint containers. The shelf life at 75°F is 6 months in the original unopened containers.

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