OEM

Industrial Digital Scales

Adhesives, Sealants and Coatings for Industrial Digital ScalesMaster Bond is a leading supplier of advanced adhesive systems for manufactures of industrial digital scales.

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UL Certified Epoxy Encapsulant Resists Arcing Without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and arcs, which may lead to combustion and fire. EP21AC is designed primarily with the aim to prevent arcing related issues.

“EP21AC withstood over 150 arcs without igniting and therefore was assigned the highest PLC (Performance Level Category) of 0 under the UL746A High Amp Arc Ignition test,” says Rohit Ramnath, Senior Product Engineer. “The compound is also flame retardant, as per the UL94HB standard for flammability testing. This combination of unique performance properties makes EP21AC suitable for encapsulating, potting or coating in many demanding applications.” The system is toughened, with an elongation of 10 to 20%, and is capable of resisting thermo-mechanical stresses. It is an excellent electrical insulator with a volume resistivity greater than 1014 ohm-cm, and a dielectric constant of 4.7 at 75°F. Other noteworthy properties include a tensile strength of 5,000-6,000 psi, and a tensile modulus of 300,000-350,000 psi at 75°F. It is serviceable over the temperature range of -60°C to +90°C [-75°F to +194°F].

EP21AC has a convenient to use 1 to 1 mix ratio by weight and cures at room temperature, or more rapidly with heat. It has good flow properties with a mixed viscosity of 30,000-50,000 cps, and a relatively long working life of 75-120 minutes at room temperature. This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in ounce kits, ½ pint, pint, quart and gallon container kits. Specialty packaging is also available in premixed and frozen syringes.

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating.

EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25°C. This electrically conductive system offers a volume resistivity of 0.02-0.06 ohm-cm and a thermal conductivity of 1.30-1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability and a glass transition temperature of 130-135°C. Serviceable over the temperature range of -60°C to +150°C [-75°F to +300°F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.

Thermally Conductive, Electrically Non-Conductive, Low Outgassing Epoxy

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. Its volume resistivity is greater than 1015 ohm-cm.

“EP40TC’s key distinguishing factor is that there is no compromise on the bond strength while providing excellent elongation and toughness. It has a high strength profile with a tensile lap shear strength of 2,300-2,500 psi, an elongation of 60-70%, and a tensile modulus of 5,000-15,000 psi,” says Rohit Ramnath, Senior Product Engineer. “Also, it meets NASA low outgassing specifications which is a prerequisite for many aerospace, electronic, and optical applications.”

Serviceable from -100°F to +300°F, this toughened system resists thermal cycling, vibration and shock. EP40TC exhibits a high peel strength of 40-60 pli and Shore D hardness of 70-80 at 75°F. It features a convenient 1:1 mix ratio, and cures in 2-3 days at room temperature or faster with the addition of heat. This compound adheres well to a variety of substrates such as metals, composites, glass, and many plastics. EP40TC is available in standard packaging, as well as premixed and frozen syringes.

Pressure Sensors

Epoxy compounds for pressure sensorsInnovative assembly, packaging, interconnection technologies employing Master Bond epoxy and silicone compounds have contributed to increased usage of pressure sensors in advanced applications.

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Non-Cytotoxic Epoxy Resists Sterilization by Autoclaving, Radiation and Chemicals

Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.

“This product resists repeated sterilization cycles, including STERRAD® and autoclaving. It is also capable of withstanding exposure to gamma radiation, ethylene oxide, bleach as well as other aggressive sterilants and chemicals. EP62-1HTMed offers a tensile strength of 10,000-11,000 psi and adheres well to a variety of similar and dissimilar substrates, including metals, plastics, rubbers, ceramics and composites. This electrically insulative compound has a volume resistivity of more than 1014 ohm-cm, a glass transition temperature of 150-155°C and is serviceable from -60°F to +450°F [-51°C to +232°C].

EP62-1HTMed has an advantageously long working life of 12-24 hours for a 100 gram mass and requires moderate heat for curing. Cure schedule options are 60-70 minutes at 176-212°F [80-100°C] or 20-30 minutes at 257°F [125°C]. Post curing at 212-302°F [100-150°C] for 3-5 hours is recommended to achieve optimal performance properties. The epoxy contains no solvents or diluents and has low shrinkage upon cure with a hardness of 80-90 Shore D. This system has a mix ratio by weight of 100 to 5 and can be supplied in standard sized units: ½ pint, pint, quart, and gallon kits. It can also be packaged in premixed and frozen syringes, which ensures that there is no mixing involved and makes it compatible for automated dispensing systems to streamline production.

Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. Its flexibility allows for stress minimization especially when bonding substrates with different coefficients of thermal expansion. It also utilizes a fluorescent dye for detection purposes, which enables easy visual inspection.

This no-mix system cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. LED405FL3 is serviceable from -100°F to +250°F. It cures with a hardness of around 5-15 Shore D at room temperature. Additional performance properties include electrical insulation as well as resistance to thermal cycling, shock and vibration.

LED405FL3 is a low viscosity system that may be used for small potting and encapsulation applications assuming that there are no shadows or concealed areas. This solvent free, RoHS compliant compound is available in syringes, ½ pint, pint and quart containers.

One Component, Graphite Filled Epoxy Features Electrical and Thermal Conductivity

Master Bond EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound is not premixed and frozen and has an unlimited working life at room temperature. It offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and a thermal conductivity of 2.88-3.46 W/(m•K) at room temperature.

“EP5G-80 is a specialty non-metallic system designed for heat sensitive electronic applications where high levels of conductivity are desired. Its key feature is that it does not need elevated heat to fully cure,” says Rohit Ramnath, Senior Product Engineer. “Unlike other graphite filled adhesives, EP5G-80 is a smooth thixotropic paste and can be easily dispensed manually or using automated systems.”

For a conductive system, EP5G-80 provides an especially high Tg of around 130°-140°C, and a tensile modulus that exceeds 1,000,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +175°C and has a low coefficient of thermal expansion. Suitable for bonding, sealing and coating, EP5G-80 adheres well to a variety of substrates such as metals, composites, ceramics and many plastics. This formulation features a good lubricity and can be employed for static dissipation and EMI/RFI shielding applications. It is black in color and RoHS compliant. Packaging is available in syringes, jar and pint containers.

Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material.

“EP3HTS-TC utilizes a non-sintering silver technology to provide ultra high heat transfer capability.” says Rohit Ramnath, Senior Product Engineer. “It is designed without compromise to dispensability or adhesion strength, while maximizing performance properties.” EP3HTS-TC is highly electrically conductive, with a volume resistivity of less than 1x10-3 ohm-cm.

The system exhibits good dimensional stability, resists thermal cycling, and has a low coefficient of thermal expansion of 20-23 x 10-6 in/in/°C. Die shear strength is 9-12 kg-f at 75°F for a 2 x 2 mm [80 x 80 mil] area. It has a glass transition temperature of 58°C and is serviceable over the temperature range of -80°F to +400°F. This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. Packaging is available in syringes, 20, 50 and 100 gram jars, as well as single and multiple pound containers.

Chemically Resistant, NASA Low Outgassing, Non-Drip Epoxy System

Master Bond EP41S-5ND Black is a two part, NASA low outgassing rated epoxy, with outstanding chemical resistance to acids, bases, alcohols and fuels. Most significantly it will withstand liquid immersion to harsh chemicals such as methylene chloride, phenol (10%) and nitric acid (30%). This system contains no solvents and cures at room temperature, or more rapidly at elevated temperatures. It provides a high glass transition temperature of 140 to 150°C, and exceptional electrical insulation properties, with a volume resistivity greater than 1014 ohm-cm.

“EP41S-5ND Black is designed for bonding and sealing applications, wherein a non-sag, paste-like consistency is required.” says Rohit Ramnath, Senior Product Engineer. “The optimum curing schedule is overnight at 75°F followed by 3-4 hours at 150-200°F. In applications where long term chemical resistance is critical, the importance of post-curing with heat cannot be overstated.”

EP41S-5ND Black has a good physical strength profile with a tensile strength measuring between 10,000 and 12,000 psi, and a tensile lap shear of 900-1,100 psi, both at room temperature. It is serviceable over the temperature range of -80°F to +450°F. This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics and many plastics and rubbers. As indicated by the product name, its color is black, and it is RoHS compliant. Packaging is available in ½ pint kits, pint kits, quart kits and gallon kits.

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