OEM

Nanosilica Filled, Electrically Insulative Epoxy Features Abrasion Resistance

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. It has a nanosilica filler that imparts dimensional stability and abrasion resistance. When measured according to ASTM D4060, standard test method for abrasion resistance, with CS-17 wheel for 1,000 cycles, EP21NS exhibits a very low weight loss of 25 mg. This formulation is a reliable electrical insulator with a volume resistivity greater than 1015 ohm-cm, an outstanding dielectric constant of 2.6 at 16.4 GHz and a dielectric strength of 450 volts/mil at 75°F, for a 1/8th inch thick specimen. It is serviceable over the temperature range of -80°F to +250°F.

This system has a long working life and good flow properties with a moderate mixed viscosity of 50,000-90,000 cps. The mix ratio of EP21NS is 1 to 1 by weight, and its optimal cure schedule is overnight at room temperature followed by 4 to 5 hours at 150°F. It features very low shrinkage upon curing, a low coefficient of thermal expansion of 30-35 x 10-6 x in/in/°C and a compressive strength of 16,000-18,000 psi.

This compound bonds well to a variety of substrates including metals, composites, glass, ceramics, rubbers and many plastics. EP21NS is resistant to water and salts. It is packaged in ounce kits, ½ pint kits, pint kits, and quart kits. The color of Part A is translucent and Part B is amber. EP21NS does not contain solvents and is RoHS compliant.

How Dual Curing Adhesives (UV Light + Heat) Improve Manufacturing

For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C. This dual cure process benefits a wide variety of bonding, coating, sealing and small encapsulation applications. Learn more about the advantages of dual cure adhesives and how they may enhance the performance properties required in your application.

Adhesive Compounds Play Key Role in Sensor Fabrication Performance

The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands. Using different fillers, manufacturers can create adhesive compounds that are optimized for specific combinations of performance characteristics like electrical or thermal conductivity, chemical resistance, and stability as well as processing characteristics like viscosity, work time and cure time. Learn more about the fundamental role that epoxy and silicone compounds play in diverse sensor devices.

Highly Flexible UV Curable Adhesive Meets ISO 10993-5 Standard for Cytotoxicity

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. Not only can it be utilized for bonding, but it can also be employed for sealing, coating, and encapsulating purposes. It has a high degree of flexibility with an elongation that exceeds 100% and a low tensile modulus of 20,000-50,000 psi at room temperature. This flexibility allows it to withstand extreme thermal cycling and mechanical shock without inducing stress on components/parts. It bonds well to similar and dissimilar substrates including glass, metals and plastics.

UV15X-6Med-2LV is a one part system that cures upon exposure to a UV light source emitting at a wavelength of 320 to 365 nm with an energy output as low as 20-40 milliwatts/cm2. It can cure in as little as 10 to 30 seconds, and in sections up to ¼ inch. A successful curing process entails complete exposure to the UV light source, for this reason there should be no shadows or UV blocking agents in the substrates used. As a one part system, it requires no mixing prior to use. This compound has a medium viscosity of 20,000-40,000 cps and is not oxygen inhibited. It is electrically insulative with a volume resistivity of more than 1012 ohm-cm at room temperature. UV15X-6Med-2LV has a refractive index of 1.50. It is serviceable over the temperature range of -80°F to +250°F.

Since UV15X-6Med-2LV meets the ISO 10993-5 certification it can be used in medical device manufacturing applications where this requirement is vital. It has good resistance to water, cleaning agents, e-beam, ethylene oxide and gamma radiation. Packaging is available in syringes, ½ pint, pint, quart and gallon sizes.

One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing EP4EN-80 is suitable not just for bonding, but also for small potting and encapsulations up to about a ¼ inch thick in some applications. Due to its ultra fine particle size filler material this system offers unique gap filling and heat transfer capabilities. It has a thermal conductivity value of 0.75-0.85 W/(m•K) and electrical insulation with a volume resistivity of more than 1014 ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns.

EP4EN-80 provides notable strength properties including a compressive strength of 24,000-26,000 psi and an ultra high tensile modulus of 1,200,000-1,400,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +150°C.

EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in ½ pint, pint, quart and gallon sizes.

Silver Conductive Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. A unique feature of this product is that despite its silicone chemistry, it passes NASA low outgassing specifications. Also, it retains superior electrical conductivity with a volume resistivity of 0.004 ohm-cm at 75°F. “This silicone is ideal for applications where low stress is required, since it is highly flexible across a wide service temperature range. It is capable of resisting aggressive thermal cycles and shocks,” says Rohit Ramnath, Senior Product Engineer.

The mix ratio of MasterSil 151S is 100 to 5 by weight, and it cures with the addition of heat. Upon mixing, it retains its smooth, paste consistency, and has a long working life of 6-12 hours for a 50 gram mass. This silicone product has an elongation between 100-150%, tensile strength of 400-700 psi and can cure beyond ¼ inch thick. It features a thermal conductivity of 1.30-1.59 W/(m•K), a coefficient of thermal expansion of 150-200 x 10-6 in/in/°C, and hardness of 80-90 Shore A. It is serviceable over the temperature range of -80°F to +400°F.

This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in 20 gram, 50 gram and 100 gram glass jars. The color of Part A is silver and Part B is clear. MasterSil 151S has a low linear shrinkage upon curing and is RoHS compliant.

Low Viscosity Epoxy Coating Features Acid Resistance

Master Bond EP21ARLV is a two part epoxy that may be used as an adhesive, sealant, coating or encapsulant. The product is capable of withstanding prolonged exposure to a wide range of chemicals, such as 70% sulfuric acid, 10% hydrochloric acid, 10% nitric acid and butyl acetate to name a few. Both parts A and B have a low viscosity of 3,000-6,000 cps and 4,000-6,000 cps, respectively. “With its low viscosity and acid resistance, EP21ARLV is a go-to material for potting and encapsulations in battery applications,” says Rohit Ramnath, Senior Product Engineer. “This combination is especially useful in applications where protection from acids is crucial.”

The mix ratio of EP21ARLV is 100 to 50 by weight, and it cures at room temperature. However, the addition of heat not only speeds up the curing process but it is also vital for optimizing acid resistance. It is a reliable electrical insulator with a volume resistivity greater than 1014 ohm-cm at 75°F, and dielectric strength of 440 volts/mil at 75°F, for a 1/8 inch test sample. Other noteworthy properties include a tensile strength of 8,000-9,000 psi, a Shore D hardness of 80-90 and a tensile modulus of 350,000-400,000 psi. It is serviceable over the temperature range of -60°F to +250°F.

This compound bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers. It is available for use in ½ pint, pint, quart and gallon container kits. Specialty packaging is also available in gun dispensers. The standard color of Part A is clear and Part B is amber clear, although it can be formulated in many different colors upon request. EP21ARLV does not contain solvents and is RoHS compliant.

Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm

Master Bond EP29LPAOHT is a two component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need to be cured. It can be mixed and poured in volumes of more than a gallon at a time. Even in deep cross section thicknesses, this product does not generate much heat. Since the epoxy does not start gelling quickly, it is especially advantageous for use in many production environments that require a long open time after mixing.

EP29LPAOHT has a 100 to 50 mix ratio by weight and a mixed viscosity of 10,000-30,000 cps. It possesses a high thermal conductivity value of 0.87-1.15 W/(m•K), and is electrically insulative with a volume resistivity of more than 1015 ohm-cm. Upon curing EP29LPAOHT exhibits low shrinkage, dimensional stability and a low coefficient of thermal expansion. Other noteworthy properties include a compressive strength of 24,000-26,000 psi, a Shore D hardness of 80-90 and a tensile modulus of 450,000-500,000 psi. This epoxy is serviceable over the wide temperature range of -60°F to +350°F.

EP29LPAOHT bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. It resists many chemicals including, but not limited to, water, fuels and oils. It is available for use in ½ pint, pint, quart and gallon container kits. EP29LPAOHT does not contain solvents and is RoHS compliant.

Medical Grade Epoxy Offers Thermal Conductivity and Electrical Insulation

Master Bond EP42HT-4AOMed Black is a new two part epoxy created for medical device manufacturing. It is biocompatible and non-cytotoxic, passing both USP Class VI and ISO 10993-5 certifications. This epoxy withstands aggressive chemical sterilants, radiation and repeated cycles of autoclaving.

EP42HT-4AOMed Black offers both cryogenic serviceability and heat resistance with a service temperature range from 4K to 400°F. Its thermal conductivity measures 9-10 BTU•in/(ft2•hr•°F) and its volume resistivity is greater than 1014 ohm-cm. The system contains a filler, which contributes to its high strength profile and dimensional stability. This adhesive bonds well to metals, composites, glass, ceramics, rubbers and plastics and features a tensile modulus of 500,000-550,000 psi, a compressive strength of 24,000-26,000 psi, and a tensile strength of 7,000-8,000 psi.

This epoxy can cure at room temperature, yet faster cures can be achieved by heat curing. In order to obtain optimal properties, an overnight cure at room temperature, followed by heat curing at 150-200°F for 2-3 hours is recommended. The mix ratio is 100 to 40 by weight. Once mixed, this versatile adhesive has very good flow properties, making it suitable for bonding, sealing and coating applications. Upon curing, EP42HT-4AOMed Black exhibits very low shrinkage, low exotherm and can be used for castings up to 2-3 inches thick. This opaque black epoxy is available in the following size kits: ½ pint, pint, quart and gallon. It is also available in pre-mixed and frozen syringes, which are compatible with automated dispensing equipment.

B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity

Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. It also passes the 12 second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F. EP36FR uses a non-halogenated filler. “These Airbus ratings are not just relevant for manufacturing aircraft components, but they are also considered to be among the most stringent of certifications for flame retardancy and toxicity,” said Rohit Ramnath, senior product engineer. “They [the ratings] serve as a good starting point for various composite applications across the aerospace, marine, transportation, electrical, and automotive industries.”

EP36FR withstands rigorous thermal cycling, as well as thermal and mechanical shocks. It has excellent high temperature resistance up to 500°F, despite a low glass transition temperature of 95-100°F. This system maintains its toughness or hardness across a wide temperature range and is ideal for potting, encapsulation, sealing as well as coating applications. The hardness values at 212°F and 300°F are in the 20-30 Shore D range.

The EP36FR formulation is B-staged, meaning it is a solid at room temperature and must be heated in a forced air or convection oven to transform it to a liquid at around 200°F. This feature allows it to be reused when it resolidifies at room temperature, provided it has not been cured. After liquefying the product at 200°F, and applying it on the substrates in the application, it needs to be heat cured for 2 to 3 hours at 350°F.

Master Bond EP36FR bonds well to metals, composites, glass and many plastics. The product is available in ½ pint, pint, quart and 30 gram preforms.

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