Two Component, Low Viscosity, Optically Clear Epoxy System For Bonding, Sealing, Coating and Encapsulation; Features Excellent Physical and Electrical Insulation Properties.
Meets USP Class VI Requirements as well as FDA CFR 175.105 for Indirect Contact with Food.
Two Component, Optically Clear, Low Viscosity Epoxy System For High Performance Bonding, Sealing, Coating, Encapsulation & Casting. Features Excellent Adhesion To Glass, Polycarbonates, And Acrylics.
Quartz Filled, Two Component Epoxy System for High Performance Bonding, Sealing, Coating & Casting, Featuring Exceptionally Low Shrinkage and High Dimensional Stability.
One Component, B-Stage, High Temperature Resistant, Toughened Epoxy System for Potting, Sealing, Coating and Bonding Applications; Featuring Low Viscosity and Excellent Electrical Insulation Properties. Available in 30 Gram Cookies.
Low Viscosity, Optically Clear Two Component Room Temperature Curing Epoxy Resin System for High Performance Bonding, Casting and Coating Applications Featuring Exceptionally Long Working Life and Low Exotherm
