Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient 1:1 Mix Ratio and Fast Cure
Two Component, Room Temperature Curing, Thermally Conductive, Electrically Insulating Epoxy Adhesive, Sealant and Coating Featuring a Convenient One To One Mix Ratio and Fast Cure.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
Two Component, Low Viscosity, Addition Cured Silicone System for High Performance Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Optical Clarity.
One Component, Room Temperature Curing, Silicone Elastomer System for High Performance Bonding and Sealing Featuring Fast-Curing and Low Viscosity. Ideal for Smaller Encapsulations and Conformal Coatings.
Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
