Master Bond Product Search

12 products match

EP21HT Two Part Epoxy System EP21HT

Two component adhesive, sealant and coating. High mechanical strength properties. Volume resistivity of 1014 ohm-cm. Dielectric constant of 2.90. One to one mix ratio. Tensile lap shear when bonding aluminum to aluminum of 3,200 psi at 75°F. Superior chemical resistance. Serviceable from -60°F to +400°F. Cures readily at ambient temperature or faster at elevated temperatures. Meets FDA 175.105 requirements for indirect food applications.

EP21HTFG Two Component Epoxy System EP21HTFG

Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F.

EP21HTND Two Component Epoxy Adhesive EP21HTND

Room temperature curing two component non-drip paste adhesive. Serviceable from -60°F to +400°F. Impressive bond strength. Gap filler. Forgiving one to one mix ratio. Meets FDA Section 175.105 for indirect food contact. Shore D hardnes >75.

EP21LV Two Component Low Viscosity Epoxy System EP21LV

Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator.

EP21LV-1 Two Part, Low Viscosity Epoxy EP21LV-1

Slightly toughened. High strength bonds. Cures readily at room temperature. Enhanced resistance to mechanical vibration and shock. Serviceable from -60°F to +250°F. Available premixed and frozen.

EP21LV3/5Med Two Part Epoxy Compound EP21LV3/5Med

Low viscosity epoxy adhesive, sealant, coating and casting compound. USP Class VI approved. Resists vibration, impact, shock., thermal cycling. Ideally suited to bond dissimilar substrates. Serviceable from -80°F to +250°F. Withstand exposure to EtO, radiation and chemical sterilants. Excellent toughness.

EP21NDFG Two Component Epoxy EP21NDFG

Non-drip epoxy paste. Meets FDA Section 107.105 for indirect food applications. Can be used for bonding, sealing, coating. Able to adjust hardness of the cured system by altering the mix ratio. Excellent electrical insulation properties. Serviceable from -60°F to 250°F.

EP30HT Two Part Epoxy EP30HT

High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values.

EP30HV Two Part Epoxy Compound EP30HV

High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F.

EP30Med Two Part Epoxy EP30Med

Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification.