Expanded Product List
Master Bond Product Search
560 products match
 |
Supreme 33ND Toughened, two component, non-drip epoxy adhesive, sealant, coating. Gap filling. Temperature range from -80°F to +425°F. Thermal shock and chemical resistant. Excellent durability and dimensional stability. Minimal shrinkage upon curing. Solid electrical insulator. Withstands 1,000 hours 85°C/85% RH. |
 |
Supreme 34AO Room temperature curing epoxy with high thermal stability. Serviceable from -60°F to +450°F. Thermal conductive/electrically insulative. Paste viscosity. Gap filling. Superior durability. Low CTE. High bond strength. Resists repeated thermal cycling. |
 |
Supreme 34CA Serviceable from -80°F to +500°F. Good flow properties. Two component epoxy system. Impressive resistance to aggressive chemicals. Oven curing. Structural adhesive. Superior electrical insulator. Used for filament winding, bonding composites, pultruded structures. |
 |
Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
 |
Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |
 |
Supreme 3ANLV-1 Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Flowable viscosity. Shore D hardness 80-90. Serviceable from -100°F to +300°F. |
 |
Supreme 3AO Low temperature curing thermal conductive epoxy adhesive. Outstanding toughness and durability. Dimensional stability. Easy application. Gray color. Serviceable from -100°F to +300°F. |
 |
Supreme 3AOHT One component, fast heat curing system. Can withstand rigorous thermal cycling. Thermally conductive, electrically insulative. Paste viscosity. Serviceable up to 350°F. |
 |
Supreme 3CCM-85 One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F. |
 |
Supreme 3DM-85 One part epoxy for bonding, sealing, and dam-and-fill applications, and chip on board encapsulations. Cures at 185°F. Reliable electrical insulator, Used as a barrier to block flow. Thermally conductive, electrically isolating, paste consistency. |