Expanded Product List
Master Bond Product Search
541 products match
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EP30FLAO Flexibilized, thermally conductive, electrically insulative potting compound. Excellent flowability. Low thermal expansion coefficient. Superior dimensional stability. Serviceable from 4k to +250°F. Resists water, oils, many solvents. Good physical strength properties. |
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EP30FLSP Low viscosity flexibilized two component epoxy resin system. Serviceable from 4k to +250°F. Well suited for potting and encapsulation. Moderately low exotherm. Good peel and shear strength. Adheres well to similar and dissimilar substrates. Resists mechanical shock, vibration and thermal cycling. |
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EP30HT High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values. |
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EP30HT-LO Thermally stable, room temperature curing epoxy. Features high optical clarity and superior physical strength properties. Passes ASTM E595 tests for NASA low outgassing. Electrically insulative. Dimensional stable, rigid bonds. Low shrinkage upon cure. Well suited for smaller potting and encapsulation applications. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +300°F. |
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EP30HV High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F. |
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EP30LP-2 Low viscosity epoxy resin system. Superb optical clarity and light transmission properties. High strength rigid bonds. Service operating temperature range from -60°F to +250°F. Ideal for potting and encapsulation. Excellent dielectric characteristics. Low shrinkage. |
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EP30LTE Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-2 Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates. |
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EP30LTE-4 Extra low thermal expansion coefficient and unmatched dimensional stability. Used for bonding, sealing, coating, casting. Service operating temperature range from -60°F to +250°F. Mixed viscosity 15,000-20,000 cps. Ambient temperature curing. |
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EP30LTE-LO Black Two component epoxy system. Low thermal expansion coefficient and dimensional stability. Bonding, sealing, casting compound. Passes NASA low outgassing specifications. Room temperature curing. Low shrinkage. Serviceable from 4k to +250°F. Successfully tested for 1,000 hours 85°C/85% RH. |