Expanded Product List
Master Bond Product Search
430 products match
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EP30F |
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EP30FL Low viscosity, optically clear epoxy. Ideal for thermal cycling and bonding sensitive components. Room temperature or low elevated temperature cure. Good flexibility. Superb impact resistance. Shore D hardness 25-40. Serviceable from 4k to +250°F. |
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EP30FLSP Low viscosity flexibilized two component epoxy resin system. Serviceable from 4k to +250°F. Well suited for potting and encapsulation. Moderately low exotherm. Good peel and shear strength. Adheres well to similar and dissimilar substrates. Resists mechanical shock, vibration and thermal cycling. |
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EP30HT High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values. |
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EP30HT-LO Thermally stable, room temperature curing epoxy. Features high optical clarity and superior physical strength properties. Passes ASTM E595 tests for NASA low outgassing. Electrically insulative. Dimensional stable, rigid bonds. Low shrinkage upon cure. Well suited for smaller potting and encapsulation applications. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +300°F. |
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EP30HV High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F. |
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EP30LP-2 Low viscosity epoxy resin system. Superb optical clarity and light transmission properties. High strength rigid bonds. Service operating temperature range from -60°F to +250°F. Ideal for potting and encapsulation. Excellent dielectric characteristics. Low shrinkage. |
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EP30LTE-4 Extra low thermal expansion coefficient and unmatched dimensional stability. Used for bonding, sealing, coating, casting. Service operating temperature range from -60°F to +250°F. Mixed viscosity 15,000-20,000 cps. Ambient temperature curing. |
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EP30LV High performance general purpose adhesive, sealant, casting compound. Low viscosity. Optically clear. High bonding strength. Electrically insulative. Easy to apply. Allows for wicking and capillary action. Room temperature curing. Serviceable from -60°F to +250°F. |
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EP30LV-1 Ultra low viscosity epoxy system. Cures at room temperature. Outstanding optical clarity. Electrically insulative. High strength rigid bonds. Fills gaps in confined areas. Serviceable from -60°F to +250°F. |