Beryllium is a very light, hard, steel-gray metal. It features high strength, stability at elevated temperatures and reflectivity. It offers outstanding thermal conductivity and is transparent to x-rays. Beryllium is non-magnetic, corrosion resistant at ambient temperatures and has a rigidity about 50% greater than steel.
- Structural components for aircraft, satellites and space vehicles
- RF transmitters
- Medical and scientific x-ray equipment
- Computer parts
Master Bond formulates adhesive products designed to bond beryllium to beryllium and beryllium to dissimilar substrates.
Consideration for Bonding Beryllium Substrates
One component, heat curable epoxy adhesive. Serviceable from -60°F to +500°F. Paste viscosity. High tensile shear and compressive strength. Chemical resistant. Machinable.
Electrically insulative compound. Excellent flowability. High flexibility. Superior tensile and compressive strength. Cures quickly. Outstanding optical clarity. Protect against boiling water. Short tack free time. Low shrinkage upon cure. Easy to apply by roller, brush, spray equipment. Serviceable from -60°F to +250°F.
Two part toughened epoxy system. Capable of continuous service at 500°F. 100% reactive. Unmatched durability. Outstanding chemical resistance. Robust physical strength profile. Dimensionally stable. Machineable. Withstands rigorous thermal cycling. Service operating temperature range from -80°F to +500°F.
High viscosity paste. Does not drip on vertical surfaces. Fast "5 minute" curing, two component epoxy adhesive. High bond strength. Serviceable from -100°F to +250°F. Superior durability. One to one mix ratio weight or volume. Excellent dielectric properties.