OEM

One Component, Dual Cure Epoxy for Medical Applications

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn't receive sufficient UV exposure, making it suitable for intricate parts and complex geometries. Notably, the adhesive meets ISO 10993-5 cytotoxicity standards, demonstrating biocompatibility for medical device applications.

UV15DC80-1Med has excellent resistance to radiation, liquid sterilants and autoclaving. This one part, no-mix epoxy has a moderate viscosity of 20,000-40,000 cps for versatile dispensing. It delivers strong bonds to various substrates, including metals, glass, ceramics, and many plastics, with a tensile strength exceeding 5,000 psi at 75°F. The cured adhesive offers a wide service temperature range from -80°F to +350°F (-62°C to +177°C) and a high glass transition temperature of 125-135°C. Additionally, it maintains optical clarity with a refractive index of 1.52 at 589 nm.

As a cationic system, UV15DC80-1Med exhibits minimal sensitivity to oxygen. The initial UV cure/tack can be achieved in seconds with UV light (325-365 nm) at a minimum UV radiation intensity of 20-40 mW/cm2. Areas with limited UV access need to be subsequently cured with heat at 80°C within 40-60 minutes. To maximize performance, post-cure at 80°C for 2-4 hours or 125°C for 30-60 minutes is recommended. UV15DC80-1Med is available in various container sizes, ranging from a ½ pint to 5 gallons, to suit project needs. It's also offered in convenient 30 cc syringes for manual or automated dispensing.

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications

Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments. It can be utilized in the aerospace, electronic, opto-electronic, and specialty OEM industries.

MasterSil 323S-LO offers flexibility and toughness, with a Shore A hardness of 35 to 55, a low tensile modulus of less than 800 psi and an elongation of 50-100%, measured at 75°F. This enables it to withstand aggressive thermal cycling and mechanical shock, while offering a wide service temperature range from -80°F to +400°F [-62°C to +204°C]. MasterSil 323S-LO is a silver filled compound that has a volume resistivity of less than 0.003 ohm-cm and a thermal conductivity of 9-11 BTU•in/(ft2•hr•°F) [1.30-1.59 W/(m•K)] at room temperature. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics, rubbers as well as many types of plastics.

MasterSil 323S-LO has an easy to use 1:1 mix ratio by weight. The system features a paste consistency with minimal flow and does not rely on humidity access for curing. This formulation offers a variety of cure schedules at elevated temperatures, including 4 to 6 hours at 160-180°F, and 2 to 3 hours at 190-210°F. MasterSil 323S-LO is available for purchase in jars ranging from 20 gram kits to one pound kits.

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimensional stability due to its nanosilica filler material. It has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands 1,000 hours at 85°C and 85% relative humidity.

EP114 has excellent electrical insulation properties with a volume resistivity greater than 1014 ohm-cm and a dielectric constant of 3.35 (60Hz) at 25°C. This system features an exceptionally low coefficient of thermal expansion of 20-22 x 10-6 in/in/°C along with a compressive strength of 24,000-26,000 psi, an ultra-high modulus of more than 1,000,000 psi and a hardness of 85-95 Shore D at 25°C. Also, it has a glass transition temperature of more than 200°C.

EP114 features excellent flow properties with a mixed viscosity of 500-1,500 cps. It offers a long working life after mixing, for example a 100-gram batch at 25°C will yield an open time of 2 to 4 days. The system requires heat for curing. One of the many recommended cure schedules is 2 to 3 hours at 125°C followed by 5-8 hours at 150°C, with a 2 hour or longer post cure at 150-200°C. It is available in various packaging options: syringe kits, 1/2-pint kits, pint kits, and quart kits. It can also be packaged in pre-mixed and frozen syringes, which require storage at -40°C and are suitable for automated dispensing.

One Part Epoxy Changes from Red to Clear Under UV Light

Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material. Although this change in color from red to clear does not indicate a full cure it does confirm that the UV light has reached the polymer. By giving immediate visual feedback UV15RCL offers processing and handling advantages over conventional systems. Curing under UV light typically takes 30-60 seconds with a broad-spectrum UV lamp emitting light with a wavelength range between 320-365 nm. The minimum energy required is 20-40 milliwatts per cm2.

UV15RCL features a high glass transition temperature (Tg) of 90-95°C. However, when post cured for 1-2 hours at 125°C, the Tg can increase to 125-130°C. It has a service temperature range from -80°F to +350°F. This non-solvent based system cures tack free and has a very low viscosity of 115-350 cps, making it ideal for spin coating. It is not oxygen inhibited and provides light transmission properties and good optical clarity, with a refractive index of 1.517. Also, it is an excellent electrical insulator with a volume resistivity exceeding 1014 ohm-cm.

UV15RCL is suitable for bonding and sealing applications as it adheres well to metals, glass, ceramics and many plastics, including acrylics and polycarbonates. It is available in a wide range of packaging options, including syringes, ½ pint, pint, quart and gallon containers.

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity

Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications.

Supreme 11AOHTMed has reliable electrical insulation properties with a volume resistivity exceeding 1014 ohm-cm at 75°F. It also exhibits thermal conductivity of around 4 to 5 BTU·in/ft²·hr·°F (0.58-0.72 W/m/K). The system provides high bond strength properties with a lap shear strength of 3,200-3,400 psi, a tensile strength of 7,000-8,000 psi and a compressive strength of 20,000-22,000 psi. This toughened formulation is designed to withstand thermal cycling and offers a wide service temperature range from -112°F to +400°F (-80°C to 204°C).

Supreme 11AOHTMed cures at room temperature in 24-36 hours, and faster with heat, in 1-2 hours at 200°F. To optimize properties, the recommended cure schedule is overnight at room temperature, followed by a post cure at 120-150°F for 2-3 hours or preferably longer. It bonds well to a wide variety of substrates including metals, ceramics, glass, rubbers, and many plastics. This epoxy system has a convenient 1:1 mix ratio by weight, with the mixed material being a thixotropic paste. To eliminate the need for manual measuring and mixing, it can be packaged in double barrel cartridges for gun kits. It is also available in standard jars and cans, ranging in size from ½ pint to gallon containers.

Rectifiers

Potting, coating and encapsulation polymers for rectifiersThese vital electronic devices are employed to convert alternating current (AC) to direct current (DC).

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Autonomous Machines

Adhesives for Autonomous MachinesMaster Bond pioneered the development of novel adhesives, sealants, and coatings, which are able to enhance the performance of autonomous machines.

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Food Grade Epoxy Features Enhanced Chemical Resistance

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. The epoxy withstands exposure to a wide range of harsh chemicals, including acids, bases, and solvents. It possesses good flow properties and can be employed for bonding, sealing, potting, and casting.

This compound has a relatively long working life of 105-150 minutes for 100 grams of the mixed material at 75°F. The color of Part A is black, and Part B is light amber, with a mix ratio of 100 to 30 by weight. EP42HT-2FG Black cures optically opaque, and the recommended cure schedule is overnight at room temperature, followed by a heat cure at 150-250°F for 3 to 4 hours.

This thermally stable system offers a glass transition temperature of 145-150°C and is serviceable over a wide temperature range from -60°F to 450°F. It has a high tensile strength of 11,000-12,000 psi at room temperature and a tensile modulus of 400,000-450,000 psi. It is electrically insulative with a volume resistivity greater than 1014 ohm-cm and a dielectric constant of 4.6 at 60 Hz, at room temperature. These attributes make EP42HT-2FG Black suitable for potting and encapsulation type applications.

The system is recommended for indirect food applications particularly where the surrounding environment may be exposed to aggressive chemical washdowns or antibacterial agents. It is available in 1/2 pint, pint, quart, and gallon kits. Specialty packaging is also available in premixed and frozen syringes.

Flexible, Thixotropic, One Component Dual Cure Epoxy

Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. The system's adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility.

UV23FLDC-80TK has a viscosity of 25,000-50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system features excellent electrical insulation with a volume resistivity exceeding 1014 ohm-cm.

UV23FLDC-80TK is not susceptible to oxygen inhibition. It bonds well to metals, glass, ceramics and many plastics, including but not limited to acrylics and polycarbonates. It has a service temperature ranging from -80°F to +300°F. It is available in a wide range of packaging options, including syringes, ½ pint, pint, quart and gallon containers.

Toughened, One Component Epoxy Features High Glass Transition Temperature

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications. It is a true one component system, not premixed and frozen, with an unlimited working life at room temperature. Supreme 17HTND-2 is thermally stable, featuring a high glass transition temperature (Tg) of 410°F (210°C). It also meets NASA low outgassing specifications per ASTM E595 testing.

Supreme 17HTND-2 has reliable electrical insulation properties with a volume resistivity exceeding 1015 ohm-cm at 75°F. It possesses high bond strength properties with a lap shear strength of 1,900-2,100 psi and a tensile strength of 7,000-8,000 psi. It is designed to withstand thermal cycling and offers a wide service temperature range from -100°F to +550°F (-73°C to 288°C). Along with its simple handling properties, it has a paste consistency and is completely non-drip, making it ideal for applications where no flow is critical.

Supreme 17HTND-2 cures at elevated temperatures with cure schedule options including 300°F for 4-6 hours or 350°F for 2-4 hours. An optimal cure schedule is at 300°F for 4-6 hours, followed by a post cure at 350°F for 8-12 hours. It bonds well to a wide variety of substrates including metal, ceramics, composites and several plastics. Black in color, it is available in standard packaging of jars and cans, ranging from ½ pint to gallon containers.

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