OEM

Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various medical and wearable device applications.

This toughened epoxy delivers an elongation of 60-70%. It has good strength properties with a tensile lap shear strength between 2,300 and 2,500 psi, a T-peel strength of 40-60 pli and a low tensile modulus of 5,000-15,000 psi at room temperature, making it ideal for applications where low stress is needed. The system’s small particle size filler allows for effective heat transfer when applied in thin layers, lowering its thermal resistance. It is also capable of withstanding exposure to EtO, radiation and several sterilants, as well as anti-microbial cleaning agents. Serviceable from -100°F to +300°F [-73°C to +149°C], EP40TCMed features reliable electrical insulation characteristics with a dielectric constant of 4.4 at 60 Hz and a volume resistivity greater than 10¹⁵ ohm-cm. Its thermal conductivity is 8-11 BTU•in/(ft²•hr•°F) [1.16-1.60 W/(m•K)].

EP40TCMed offers convenient handling with a 1:1 mix ratio by weight, and has a relatively long working life of 2-3 hours for a 100 gram batch of mixed epoxy at 75°F. After mixing, the epoxy has a moderate viscosity of 80,000-100,000 cps, which is useful for applications where some, but not too much flow is required. Upon cure, it has low shrinkage and a hardness of 70-80 Shore D. EP40TCMed comes in standard sized units of ounce jars, ½ pint, pint, quart, and gallon kits. It is also available in premixed and frozen syringes.

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance.

EP5LTE-100 passes NASA low outgassing specifications. It provides a tensile modulus that exceeds 1 million psi at room temperature. Minimal shrinkage upon cure combined with a low CTE of 8-12 x 10^-6 in/in/°C enables precise alignment for bonding dissimilar substrates with low coefficients of thermal expansion. With a T_g between 120-125°C, and a service temperature range from -60°C to +175°C, this epoxy is effective in high temperature environments. It is a reliable electrical insulator featuring a volume resistivity of more than 10¹⁴ ohm-cm.

EP5LTE-100 bonds well to a wide variety of substrates including metals, glass, composites, ceramics and many plastics. It has good resistance to water and damp heat. The compound has an unlimited working life at room temperature and requires a heat cure at 100°C for 90-120 minutes. Optimum properties are obtained by post curing for 2-3 hours at 100-125°C. The epoxy is available in syringes, jars, and cans.

Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat, and adheres well to both similar and dissimilar substrates.

“Conventional light curing adhesives do not allow light penetration beyond 1 mm. LED415DC90’s key distinguishing factor is its ability to partially cure or fixture up to 6 mm deep or in cross sections under LED light at the right intensity,” says Rohit Ramnath, Senior Product Engineer. “That enables a unique practical feature of this product: fixturing of components which are opaque. The mechanism in which this occurs is by allowing the light to penetrate through the adhesive from the sides and not needing light to be exposed throughout the entire areas. It must be noted that post curing with heat at about 95°C for 30-60 minutes is critical for enhancing strength and overall performance.”

LED415DC90 has a thixotropic index of 5.53 at room temperature. It has a good physical strength profile with a tensile strength of 5,500-6,500 psi, a tensile modulus of 450,000-550,000 psi, and lap shear strength for Aluminum to Aluminum of more than 1,000 psi. This rigid system cures with a hardness of around 85-90 Shore D and elongation of 1-3% at 75°F. Serviceable from -80°F to +350°F, it is electrically non-conductive with a volume resistivity greater than 10¹⁴ ohm-cm. It is available in EFD® syringes, ½ pint, pint and quart containers.

Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (T_g) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility.

Supreme 42HT-2ND Black is electrically insulative with a volume resistivity greater than 10¹⁴ ohm-cm. This compound has a Shore D Hardness of 75-85 at 75°F and withstands rigorous thermal cycling. It passed damp heat reliability testing for 1,000 hours at 85°C and 85% relative humidity. It offers a high strength profile, with a tensile strength of 9,000-10,000 psi and a tensile modulus of 300,000-350,000 psi at 75°F.

With a forgiving mix ratio of 100 to 40 by weight or 100 to 50 by volume, this paste consistency material can be easily applied with the use of a gun dispenser or spatula. It cures at ambient temperature in 2-3 days, or faster with the addition of heat. Adding heat not only speeds up the curing process but also optimizes the overall performance properties. Supreme 42HT-2ND Black is available in standard packaging, double barrel cartridges for gun kits, as well as pre-mixed and frozen syringes.