One Component Epoxy System for Bonding, Sealing, Coating and Casting. Notable Retention of Properties at High Temperatures, Serviceable Up to 600°F. Qualifies to NASA ASTM E595 for low outgassing.
Two Component, Low Viscosity, Optically Clear Epoxy Featuring Outstanding Temperature and Chemical Resistance for Service up to 450°F. Requires Heat Curing at 250-300°F. Meets NASA low outgassing specifications.
Two Component, Low Viscosity, Silicone Compound for High Performance Casting, Potting & Encapsulation and Sealing, Featuring High Temperature Resistance, Outstanding Flexibility and Unsurpassed Thermal Conductivity.
Two Component, Low Viscosity, Room Temperature Curing Epoxy for Bonding, Sealing, Potting and Encapsulation Featuring Very Low Exotherm and a Long Working Life.
