Expanded Product List
Master Bond Product Search
180 products match
 |
Supreme 3HTND-1SM One part, oven curing system (cures at 125-150°C) with rapid curing. Good physical properties. Paste consistency. Recommended for surface mounting. Void filling. Low ioinic impurities. Superior "green" strength. No stringing. Withstands thermal stress. Consistent dot profile. Can be automatically dispensed for high volume applications. Serviceable from -100°F to +350°F. |
 |
Supreme 3HTND-2CCM Toughened epoxy system for bonding, sealing, coating, encapsulation, glob topping. Requires no mixing. Rapid heat curing Passes NASA low outgassing testing. Transfers heat efficiently. Ideal rheology and flow for multiple applications. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
 |
Supreme 3HTND-2DA One component, fast curing die attach adhesive. Excellent die shear strength. Serviceable from -100°F to +400°F. Low ionics. Superior thermal conductivity and electrical insulation properties. Dispenses smoothly without tailing or bleed out. Cures in 5-10 minutes at 150°C. NASA low outgassing approved. Available in syringes. Well suited for automatic dispensing. Performed well in 85°C/85% RH testing. |
 |
Supreme 3HTND-2DM Toughened epoxy paste system for damming applications. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
 |
Supreme 3HTND-2DM-1 Toughened epoxy system for bonding, sealing and specialty dam-and-fill encapsulation. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F. |
 |
Supreme 3HTND-2GT Superior one part glob top. Outstanding dimensional stability and temperature resistance. Fast cures at 125-150°C. Ideal flow for glob topping. Serviceable from -100°F to +400°F. Excellent electrical insulation properties. Low shrinkage. Resists thermal cycling. |
 |
Supreme 45HTAO Toughened, thermally conductive epoxy compound. Superb electrical insulator. Resists -80°F to +500°F. High strength properties. Two part system. Oven curing. Long-term durability. |
 |
X5N Easy to use, nickel filled elastomeric adhesive. No mix system. Good electrical conductivity. Used for shielding. Room or elevated temperature curing. Withstands thermal cycling. Serviceable from -80°F to +250°F. |
 |
X5SC Single component silver filled elastomeric adhesive, coating. Excellent electrical conductivity. Highly effective for shielding. Cures at room or elevated temperatures. Paste viscosity. Superior thermal conductivity. Performs well when subjected to thermal cycling, vibration. Serviceable from -80°F to +250°F. |
 |
X5TC One part, thermally conductive adhesive offers convenient handling and application. Material is very thick but simultaneously very flowable. Relatively fast curing. Excellent electrical insulator. Good peel and shear strength properties. Well suited for bonding dissimilar substrates. Serviceable from -80°F to +250°F. |