Adhesive Bonding for Improved Aesthetics

Visual aesthetic design plays an important role in new product development. It is imperative to product differentiation, branding and marketplace sales. Unique appearance requires collaboration/coordination with suppliers who bring external expertise.

Industrial Robots

Epoxy compounds for cable harness assembliesMaster Bond structural adhesive bonding systems replace traditional mechanical fastening techniques such as welding/riveting to reduce weight, improve performance, efficiency, durability and prolong longevity of industrial

Undefined

Military Electronics

Epoxy compounds are used for military electronic assembliesAdvanced Master Bond products have been developed for the assembly of military defense electronic systems, subsystems, components.

Undefined

Adhesives for Electronic Security Devices

Epoxy compounds for electronic security devicesFrom access controls to fire protection equipment to burglar alarms to CCTV surveillance systems Master Bond polymeric compounds provide job proven tailor made solutions for the security industry.

Undefined

One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation

Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds. One method is referred to as glob top, where the encapsulating system is dispensed and applied directly to the area to be protected. The dam-and-fill method entails dispensing the damming material around the area to be encapsulated. This material will cure in place and will not run, in essence forming a dam. Then an encapsulating material is applied to cover the remaining area to be protected. This system can be cured in thicknesses up to ¼ inch.

Supreme 3HTND-2DM passes ASTM E595 specifications for NASA low outgassing enabling it to be used in vacuum, aerospace, electro-optic and other related applications. This high performance compound bonds well to a wide variety of substrates used in electronics including silicon and other semiconductors, metals, ceramics and many plastics. Most importantly, Supreme 3HTND-2DM has enhanced dimensional stability and has a tensile strength of 6,000-7,500 psi at room temperature. It also maintains its Shore D hardness of 85 after withstanding 1,000 hours at 85°C/85% RH.

As a toughened system, Supreme 3HTND-2DM resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 10-11 BTU•in/ft2•hr•°F [1.44-1.59 W/(m·K)]. This epoxy withstands exposure to water and chemicals such as acids, bases, fuels and a number of common solvents. It is considered to have to have low ionic levels of chlorine, sodium and potassium (less than 10 ppm).

This single component system is easy to handle and offers “unlimited” working life at room temperature. It cures readily at 250°F in 20-30 minutes or 5-10 minutes at 300°F. It is serviceable from -100°F to +400°F [-73°C to +204°C]. Supreme 3HTND-2DM is available for use in syringes, cartridges and jars.

Room Temperature Curing Epoxy Features Low Thermal Resistance

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic, optical and OEM industries.

EP30TC exhibits a thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and has  the ability to be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance of 7-10 x 10-6 K•m2/W. This compound is a reliable electrical insulator and has a volume resistivity of over 1014 ohm-cm. It is serviceable over the wide temperature range of -100°F to +300°F [-73°C to +149°C].

EP30TC features a low viscosity with excellent flow properties making it well suited for coating and potting applications. As a two part system, it requires a 10 to 1 mix ratio by weight. Color coding facilitates mixing with Part A being gray and Part B being clear. It can be cured at room or elevated temperatures, but to achieve optimum properties, the recommended cure schedule is overnight at ambient temperature followed by 2-3 hours at 150-200°F.

This system bonds well to metals, composites, ceramics, glass and many plastics. It delivers superior physical strength properties, with a tensile strength of 5,000-6,000 psi, a compressive strength of 24,000-26,000 psi and a tensile modulus of 500,000-550,000 psi. Dimensionally stable, EP30TC also has very low shrinkage upon curing and a low coefficient of thermal expansion.

This product is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits, as well as in premixed and frozen syringes.

Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This one part system delivers superior resistance to a variety of sterilization methods such as chemical sterilants, EtO, radiation and especially autoclaving.

As a one component system, EP3HTND-2Med Black does not require any mixing and essentially has an unlimited working life at room temperature. This epoxy has a paste consistency and is formulated not to flow while curing. It cures within minutes when heated at 250-300°F. The higher the temperature, the faster the cure speed. Also, it has low shrinkage upon curing.

This system bonds well to a wide variety of substrates including glass, metals, ceramics and most plastics. EP3HTND-2Med Black features a tensile strength of 5,000-6,000 psi and a tensile lap shear strength of 1,600-1,800 psi at room temperature. It is a competent electrical insulator with a volume resistivity exceeding 1014 ohm-cm. The service temperature range of this compound is -60°F to +400°F [-51°C to +204°C]. EP3HTND-2Med Black is available in ½ pints, pints, quarts, gallons and 5 gallon containers as well as syringes. This epoxy has a 6 month shelf life when stored at room temperature in its original, unopened containers.

Solvent Resistant Adhesive Withstands Methylene Chloride, Alcohols and Fuels

Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance. This system can be used in the aerospace, electronic, power, chemical processing, specialty OEM and other industries.

Well suited for coating pumps, tanks, storage vessels and piping, EP41S-5 is able to deliver long-term protection against a wide array of chemicals including acids, bases, alcohols, fuels and many solvents. Most noteworthy is its resistance to methylene chloride, a common stripping agent. This makes EP41S-5 ideal for tamper proofing applications in the electronic industry.

EP41S-5 offers convenient handling with a 100 to 25 mix ratio by weight. The mixed epoxy has good flow properties with a moderate viscosity of 25,000-30,000 cps. It bonds well to a wide variety of substrates including metals, composites, glass, ceramics, as well as many rubbers and plastics. EP41S-5 will cure at room temperature or more rapidly at elevated temperatures. Upon curing, this system is rigid, with a hardness of 85-95 Shore D. It has a tensile strength of 10,000-12,000 psi at room temperature. Additionally, EP41S-5 features reliable electrical insulation characteristics with a dielectric constant of 3.5 at 60 Hz and a volume resistivity greater than 1014 ohm-cm.

EP41S-5 is serviceable over the wide temperature range of -80°F to +300°F [-62°C to +149°C]. Its natural color is black, but can be formulated in additional colors. This solvent free system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits as well as double barrel cartridges that can be dispensed in gun applicators.

Potting and Impregnation Compounds for Ignition Coils

From motorcycles to automobiles to marine engines to power generators to lawn mowers Master Bond epoxy potting/impregnation resins protect ignition coils for reliable/dependable long term performance. Our solventless, high dielectric, low viscosity one and two component systems completely penetrate coil windings and assure insulation even upon exposure to high voltage conditions.

Resistors

Potting, coating and encapsulation polymers for resistorsMaster Bond potting, encapsulation, coating compounds offer superior electrical insulation properties and protect resistors from chemicals, solvents, moisture, contaminants, corrosion, dust, dirt, extreme temp

Undefined

Pages