One Component Epoxy

Biometric Devices

Adhesive, sealant and coating compounds for biometric devicesMaster Bond adhesives, sealants, coatings play an integral role in the assembly of these technologically advanced security identification and authentication devices.

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One Part Fast Curing Epoxy for Bonding and Small Encapsulation Applications

Master Bond EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C, unlike conventional one component heat curing systems. It features a quick cure profile at 65°C for 90 minutes plus 30 minutes at 80-85°C. The epoxy system requires no mixing prior to use, has a very low viscosity of 600-1,800 cps and contains no solvents. Free flowing EP4EN-80 is suitable not just for bonding, but also for small potting and encapsulations up to about a ¼ inch thick in some applications. Due to its ultra fine particle size filler material this system offers unique gap filling and heat transfer capabilities. It has a thermal conductivity value of 0.75-0.85 W/(m•K) and electrical insulation with a volume resistivity of more than 1014 ohm-cm at room temperature. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns.

EP4EN-80 provides notable strength properties including a compressive strength of 24,000-26,000 psi and an ultra high tensile modulus of 1,200,000-1,400,000 psi at room temperature. It is serviceable over the temperature range of -50°C to +150°C.

EP4EN-80 bonds well to a variety of substrates such as metals, composites, ceramics and many plastics. It effectively resists waters, oils and fuels. This compound is gray in color and is RoHS compliant. Packaging is available in ½ pint, pint, quart and gallon sizes.

How critical is the volume of an underfill fillet?

In order to understand the importance of the volume dispensed to create an underfill fillet, let us first take a look at what an adhesive fillet looks like.

CubeSats

Adhesives for CubeSatsMaster Bond has been a preferred supplier of adhesives, sealants, coatings, and potting/encapsulation compounds used in the construction of CubeSats.

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B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity

Master Bond EP36FR is a specialized one part epoxy that meets Airbus specifications for toxic gas emissions per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F. It also passes the 12 second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F. EP36FR uses a non-halogenated filler. “These Airbus ratings are not just relevant for manufacturing aircraft components, but they are also considered to be among the most stringent of certifications for flame retardancy and toxicity,” said Rohit Ramnath, senior product engineer. “They [the ratings] serve as a good starting point for various composite applications across the aerospace, marine, transportation, electrical, and automotive industries.”

EP36FR withstands rigorous thermal cycling, as well as thermal and mechanical shocks. It has excellent high temperature resistance up to 500°F, despite a low glass transition temperature of 95-100°F. This system maintains its toughness or hardness across a wide temperature range and is ideal for potting, encapsulation, sealing as well as coating applications. The hardness values at 212°F and 300°F are in the 20-30 Shore D range.

The EP36FR formulation is B-staged, meaning it is a solid at room temperature and must be heated in a forced air or convection oven to transform it to a liquid at around 200°F. This feature allows it to be reused when it resolidifies at room temperature, provided it has not been cured. After liquefying the product at 200°F, and applying it on the substrates in the application, it needs to be heat cured for 2 to 3 hours at 350°F.

Master Bond EP36FR bonds well to metals, composites, glass and many plastics. The product is available in ½ pint, pint, quart and 30 gram preforms.

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature

Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver. However, with this specialty formulation, a high Tg of 140-150°C is maintained and it passes MIL-STD-883J thermal stability requirements at 200°C.

Its strength profile is also notably robust with a die shear strength of 35-40 kg-f at room temperature. EP17HTS-DA meets NASA low outgassing specifications and its service temperature extends from -80°F to 550°F. It has a low volume resistivity of less than 0.005 ohm-cm and also performs well as a heat conductor.

EP17HTS-DA is a thixotropic paste and can be easily dispensed manually or via automated dispensing systems. This compound is not premixed and frozen and has an unlimited working life at room temperature. It requires a heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.

This product bonds well to many substrates including metals, ceramics and plastics. It is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 grams to several pounds.

Crystallization and Epoxies

Epoxies containing crystals prior to mixing and curing are a relatively infrequent occurrence. With two part systems, crystals may appear in Part A or less frequently, in Part B. It is most likely to occur upon exposure to relatively colder temperatures during shipping or while in storage. Due to crystallization, the viscosity of the epoxy could increase.

Using Adhesives for Mass Production

Adhesives systems for mass productionSpecialized Master Bond adhesive systems are engineered for mass production applications.

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Adhesives Used in Mass Transit

Adhesives systems for mass transitSubways, city buses, ferries, cable cars, trams, rail networks enable large volumes of people to move safely, reliably, speedily, comfortably, cost effectively between many locations.

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What are the mold release options for casting with an epoxy?

Epoxies are thermoset polymers with impressive physical strength, temperature, and chemical resistance among many other desirable properties. They have many functions not just limited to bonding, sealing, and coating, but also for casting applications.

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