One Component Epoxy

High Power Electronics

One and two component Master Bond epoxy, silicone systems are ideally suited to meet stringent high power electronic packaging/assembly requirements. These adhesives, encapsulants, thermal interface materials provide heat/chemical stability, mechanical strength, superior electrical properties for reliable, efficient, cost effective, high density designs.

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Piezoelectronic Devices

Epoxy and silicone formulations for piezoelectronic devicesCarefully blended epoxy, silicone formulations for potting/bonding play a crucial role in the assembly of stack actuators, piezo buzzers, piezo sensors, custom transducers.

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Cable Harness Assemblies

Epoxy compounds for cable harness assembliesMaster Bond epoxy, silicone compounds bond, protect, seal, insulate cable harness assemblies against moisture, chemicals such as oils, fuels, hydraulic fluids.

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No Mix, Thermally Conductive, Electrically Insulative Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)] and a volume resistivity exceeding 1014 ohm-cm. EP3UF also passes NASA low outgassing tests and can be used for bonding and underfills in microelectronics packaging/assembly applications.

As a single component system, EP3UF is easy to handle with an “unlimited” working life at room temperature and fast cures at temperatures as low as 250°F. This high performance system delivers a tensile strength of 5,000-7,000 psi and a compressive strength of 18,000-20,000 psi. It bonds well to a variety of substrates such as metals, composites, ceramics, and many plastics. This dimensionally stable compound has low shrinkage upon curing.

EP3UF withstands many chemicals, including water, cleaning solvents, oils and fuels. This light yellow colored epoxy is serviceable over the temperature range of -60°F to +250°F [-51°C to +121°C]. It is available for use in 10 cc syringes, 30 cc syringes, ½ pint and pint containers and has a 6 month shelf life at room temperature in its original, unopened containers.

Thermally Conductive, Electrically Insulative Epoxy Features Long Working Life

Well suited for large potting and encapsulation applications, Master Bond EP29LPAO is a cost effective, two part system with a low viscosity, excellent flow properties and heat dissipation properties. Featuring convenient processing, this epoxy has a forgiving 100 to 50 mix ratio by weight and a pot life of 7-9 hours at room temperature for a 100 gram mass. Upon curing, EP29LPAO exhibits low exotherm, even in large volumes. This dimensionally stable formulation has low shrinkage upon cure, both linearly and volumetrically.

EP29LPAO delivers a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)] and superb electrical insulation values, including a volume resistivity exceeding 1015 ohm-cm. Additionally it offers an outstanding high strength profile, with a tensile modulus of 450,000-500,000 psi and a compressive strength of 24,000-26,000 psi at 75°F. This product bonds well to a wide range of substrates such as metals, glass, ceramics and many plastics. EP29LPAO cures at room temperature or more rapidly at elevated temperatures. An optimum cure schedule is overnight at 75°F followed by 4-5 hours at 150°F.

Often used in the aerospace, electronic, electrical and specialty OEM industries, EP29LPAO is serviceable from -60°F to +250°F. It resists chemicals including water, fuels and oils. This off-white colored system is available for use in ½ pint, pint, quart, gallon and 5 gallon container kits as well as premixed and frozen syringes.

One Part, Electrically Conductive Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries.

Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than 0.001 ohm-cm. It also has a thermal conductivity of 12-15 BTU•in/(ft²•hr•°F) [1.73-2.16 W/(m·K)]. EP3HTS is dimensionally stable and bonds well to metals, glass, composites, ceramics and many plastics. It withstands a variety of chemicals such as water, oils, fuels and cleaning agents. This high temperature resistant system is serviceable over the wide temperature range of -60°F to +400°F.

As a one part compound, EP3HTS-LO offers convenient handling with no mixing and an unlimited working life at room temperature. This smooth thixotropic paste can be readily dispensed from a syringe. It polymerizes quickly at elevated temperatures with cure schedules of 45-50 minutes at 250°F or 20-30 minutes at 300°F.

EP3HTS-LO is available for use in glass jars and syringes. It has a minimum shelf life of 3 months and a maximum of 6 months at ambient temperatures in its original, unopened containers.

Prototyping

Product development engineers rely on Master Bond adhesives, sealants, surface coatings, potting, encapsulation, casting compounds for solutions to critical prototyping requirements. Our products are engineered to meet difficult performance specifications and cost effectively speed materialization. New designs can be effectively built and reworked.

Bus Manufacturing

Custom formulated epoxies for the assembly of bus vehiclesFrom structural bonding to flange sealing to sound/vibration damping to lightweighting to corrosion protection Master Bond is leading the way in bus manufacturing applications.

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Toughened One Component Epoxy for Chip Coating Applications Meets NASA Low Outgassing Specifications

Formulated for many electronic applications, Master Bond Supreme 3HTND-2CCM is a multifunctional epoxy that is well suited for chip coating, glob top and die attach applications as well as for bonding, sealing and encapsulation. Since it is a one part system, it does not require mixing and has an “unlimited” working life at room temperature. This epoxy passes NASA low outgassing tests which allow it to be used in vacuum, aerospace and clean room applications.

Supreme 3HTND-2CCM has a paste consistency that flows slightly while curing. It cures readily at elevated temperatures. The minimum curing schedule is 20-30 minutes at 250°F or 5-10 minutes at 300°F. This is a filled system with low shrinkage upon curing and sound dimensional stability. It bonds well to a wide variety of substrates used in electronics including metals, composites, ceramics and many plastics. This high strength system delivers tensile lap shear, tensile and compressive strength of 1,800-2,000 psi, 6,000-7,500 psi and 15,000-17,000 psi, respectively.

This electrically insulative compound features a thermal conductivity of 10-11 BTU•in/ft2•hr•°F [1.44-1.59 W/(m·K)]. Supreme 3HTND-2CCM resists many chemicals, such as water, acids, bases, fuels and some solvents. Its inherent toughness allows it to withstand aggressive thermal cycling.

Supreme 3HTND-2CCM is serviceable over the wide temperature range of -100°F to +400°F. This epoxy has a black color and is available for use in syringe, pint, quart and gallon containers.

One Component Epoxy Adhesive Has Ultra Low Thermal Resistance and Meets NASA Low Outgassing Specifications

Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]. Heat transfer capabilities of this product are outstanding. Supreme 18TC also passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries.

Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including high/low temperatures. It bonds well to a wide variety of substrates including metals, composites, ceramics and plastics. This compound offers a tensile lap shear strength of 2,200-2,400 psi, a tensile strength of 6,000-7,000 psi, a t-peel strength of 5-10 pli and a compressive strength of 22,000-24,000 psi.

Significantly, Supreme 18TC is a one part system that requires no mixing. Its working life is essentially “unlimited”. It requires heat curing for 60-90 minutes at 250-300°F. A post cure of a few hours at 350°F will optimize performance properties. Supreme 18TC features a low shrinkage upon curing, a low CTE and a high degree of dimensional stability. This system is also a reliable electrical insulator.

Supreme 18TC is designed to withstand thermal cycling and shock. It is serviceable over the wide temperature range of 4K to +400°F. This formulation is available for use in a variety of standard packaging options in sizes ranging from ounces to gallons.

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